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Interposers that support high input/output density are becoming critical for system miniaturization and high performance. Silicon and glass are emerging as the primary candidates for such high-density interposers, due to their outstanding dimensional stability, which enables layer-to-layer wiring with small vias. However, silicon and glass have very low coefficient of thermal expansion (CTE), 3–8...
Ultra-miniaturization and 3D integration of electronic systems require interposers with high density of off-chip interconnections. Silicon and glass interposers are being developed widely to meet these needs. These substrate materials have the intrinsic advantage of very high dimensional stability over traditional organic substrates [1] thus providing opportunities for layer to layer wiring with very...
Trend towards ultra-miniaturization of packages and systems has necessitated the use of high I/O interposers or packages made of either silicon or glass [1]. However, both of these materials have low coefficient of thermal expansion (CTE) compared to organic boards, thereby raising interconnection reliability concerns when assembled directly on the organic system boards. This paper presents an approach...
Stress-induced birefringence in silica-on-silicon waveguides is analyzed by the finite element method using the normalized plane strain model. The simulation results show that the thermal expansion coefficient of the upper-cladding is the most critical factor. A waveguide with zero birefringence is obtained and used to realize polarization independent AWGs.
This paper reports the theoretical and experimental investigations of the strain sensitive effect of a 2D photonic crystal (PhC) nanocavity resonator for mechanical sensing applications. By using finite element method (FEM) using ANSYS software and finite different time domain (FDTD) simulation using CrystalWave software, the strain sensitivity of a high quality factor PhC nanocavity has been studied...
This paper reports the theoretical investigation of the strain sensitive effect of a 2D photonic crystal (PhC) nanocavity resonator for mechanical sensing applications. By using finite element method (FEM) using ANSYS software and finite different time domain (FDTD) simulation using CrystalWave software, the strain sensitivity of high quality factor PhC nanocavity have been studied. Linear relationships...
The effect of dihedral angles in the junction region of tensoresistive layer to contact pads on strain distribution in mesa-piezoresistor body was studied using the finite element method. Influence of mesa-piezoresistor geometry on its sensitivity was demonstrated.
There is an increasing need to fabricate power devices that are lightweight and compact. However, reducing the weight of power devices would result in reduced stiffness, and greater compactness would result in increased current density, which, in turn, would increase the temperature of the device and cause deterioration. Thus, to realize lightweight, compact power devices with sufficient reliability,...
In this study, three examples of failure analyses of electronic packaging by using the finite element method are presented. These are: (1) the failures (delaminations) near the interface between the filled copper and the silicon and between the copper and the silicon dioxide dielectric of the TSV of a 3D system-in-package (SiP) due to the local thermal expansion mismatch between the silicon and the...
Multi-physics multi-scale modeling issues in various stages of the LED manufacturing, 3D-SiP, and nano interconnects have been discussed. Molecular dynamics (MD) and finite element method (FEM) have been used to study the scale effect of the material properties and the prediction of the module behaviors which are critical to LED fabrication. We propose a new concept to integrate multi-physics/multi-scale...
Uniaxial stress induced by recessed or embedded Si1-yCy source/ drain in nanoscale nMOSFETs is computed using finite element method adopted in numerical process simulator. The lateral, vertical and perpendicular stress components Sxx, Syy and Szz, respectively, are determined as a function of mole fraction y in the range 0.5 - 2.5 % and channel length L between 22-130 nm. Simulation results show that...
A multi-physics multi-scale modeling platform has been developed and it has been applied to various stages of the LED manufacturing such as MOCVD reactor design, epitaxial growth based on silicon wafer, chip design and manufacturing, module packaging and assembly, and specific lamps. Discussions are also given to the ultra-scalable reactor design, material constitutive modeling, and curvature evolution...
A nondestructive evaluation system for detecting delamination between a chip and micro bumps in 3D-stacked structures is indispensable for highly reliable and low-cost manufacturing. In stacked structures, it is hard to inspect the adhesion condition of metallic bumps that connect a lower chip with an upper chip because most of the bumps are invisible. We have, therefore, proposed a new nondestructive...
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