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This paper presents results of Frequency Domain Spectroscopy (FDS) and Polarization/Depolarization current (PDC) for understanding the combined effects of copper corrosion and moisture content in paper oil insulation of transformers. This method is not fully exploited and documented for applications to field studies. Hence an attempt is made to understand the effects of copper corrosion and moisture...
Gold and copper ball bonds were isothermally aged under moist conditions (85°C and 85% relative humidity (RH)) and wet conditions (85°C in DI water with and without NaCl) in an effort to better understand the corrosion mechanisms that operate under moist and wet conditions. The objective of this work is to undertake and report on the initial stages of a research project that aims to compare the performance...
High gold prices have led to renewed interest in replacing gold with copper in existing packages and new packages in order to save costs. Although reliability is often cited as a reason for using copper, the main driving force for its use is undoubtedly cost. Perceptions that copper wire is more reliable are based on the notion that the intermetallics grow more slowly and that thinner intermetallics...
The moisture uptake has different effects on the performance of electronic components; besides electrochemical migration, moisture affects increasing the dielectric constant of electronic substrates, i.e. multichip module, printed circuit boards and hermetic packages, consequently this cause electrical failures and signal delay. This study explains the effects of moisture and air contaminates on the...
In plastic power devices, the interfaces of Cu/EMC are most likely to delaminate under thermal loading, especially when moisture diffuses into the interface through EMC. In this work, the bare die samples were fabricated in standard commercial process. Shear test of Cu/EMC interface was designed to measure the strength of the interface with different lead-frame oxidation and moisture absorption time...
In power management semiconductor industry, the most comprehensively used metals in microelectronic packages include copper, aluminum, nickel, gold and silver. When different metals contact to each other, intermetallic compound (IMC) will form at the interface. Under different conditions, IMC may vary to show very complicated characteristic and composition, some Moderate IMC will increase interfacial...
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