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Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may merge and electrically short circuit neighboring features on the PCBs. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) test chamber in which the relative humidity...
The proliferation of the Internet of Things (IOT) and the increasing reliance on cloud computing are critically dependent on the reliable operation of Information Technology (IT) equipment. The associated increase in the power consumption by IT equipment is putting pressure on the data center administrators to expand the temperature-humidity operating envelope and in some cases resorting to airside...
In recent years, the data center reliability is paid more attention due to in cloud computing application. In general, the longer term reliability requirement is concerned for it than in general products when in service life. With the more and more severe environmental pollution, the air quality will also directly or indirectly influence the life of data center wherever indoor and outdoor. The air...
Cloud computing and storage now are more important for people's life. Data center set-up is more popular all over the world. For the cooling of the computing server, a lot of data center choose the natural air circulation method replacing traditional one to save the power consumption. So from the natural air circulation, more reliable issue will come from the quality of air depending on which place...
Corrosion driven electronic hardware failures are a concern for data center and mission critical server applications. Increasing needs for ubiquitous computing has resulted in an explosive growth of data centers around the world. It has been observed that in emerging markets the contamination either from polluted air or through particulate matter gets inside the electronic systems impacting their...
Creep corrosion is the corrosion of the copper (and sometimes silver) metallization on PCBs and the creeping of the corrosion product (mostly sulfides of copper and sometimes silver) on the board surfaces which may lead to the electrically shorting of neighboring features on PCBs. The problem of creep corrosion has been largely brought under control by selecting finishes, by trial and error, that...
Creep Corrosion is the common factor to cause electronic products failed. Cloud Computing is getting more and more popular in recent years so people's daily life correlate closely to Cloud Computing. Many global companies built the huge data center in different countries. The challenges Cloud Computing facing are Transmission Technology, Cooling System, Energy Consumption and Air Pollution. Also,...
This study focuses on the evaluation and comparison on the corrosion resistance of different kinds of surface finishing on printed circuit boards (PCBs) under high sulfur environments. The modeling clay being used is made by Chavant (type J-525) Company in this experiment. The content of sulfur in this clay was measured by an X-ray energy dispersive spectroscope and was about 18% (weight percentage)...
This study focuses on the corrosion of immersion silver (ImAg)-finished copper land patterns on printed circuit boards (PCBs) under H2S exposure. Eight test conditions were examined with varying levels of H2S, temperature, relative humidity, and exposure time. The results indicated both direct chemical-reaction corrosion and electrode-reaction corrosion, particularly galvanic corrosion. H2S gas was...
This study focuses on a method of reliability assessment for creep corrosion on immersion silver-finished PCBs utilizing the mixed flow gas (MFG) test and clay test. Four kinds of locations were defined to conveniently describe the location from which the dendrite corrosion products were growing: IL refers to the location that corrosion products grew from a hole or pad edge with solder mask; IIL refers...
This paper discusses issues regarding the reliability of immersion silver (ImAg) surface finish on printed circuit boards (PCBs) in high-sulfur environments with a focus on creep corrosion. The test approach used clay with sulfur to drive corrosion. It was found that silver sulfide had formed on the ImAg surfaces, but dendrite-shaped creep corrosion products were formed on the edges of the ImAg finished...
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