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Significant innovations in Pb-free solder alloy compositions are being driven by volume manufacturing and field experiences. As a result, the industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu (SAC) alloys. The increasing number of Pb-free alloys provides opportunities to address shortcomings of near-eutectic SAC, such as the poor mechanical...
In this study, VQFN (very thin quad flat no lead) assembly with Sn-Ag-Cu lead-free solder and Ni/Au board finish was tested under three-point and four-point cyclic bend at room temperature (25degC) and high temperature (125degC). Correlation between three-point and four-point bend was performed. It was found that the cycle to failure increases significantly with displacement ranges decreasing for...
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