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The impact toughness evaluation and fracture mechanism analysis in board level of Sn-3 mass%Ag-0.5 mass%Cu solder joints of ball grid arrays (BGAs) using electrolysis Ni/Au plating were performed. The cause of impact toughness degradation of BGA solder ball joints is the segregation of impurities to the (Cu, Ni)6Sn5 intermetallic compound grain boundary formed in the solder joints. The impurities,...
In this study, VQFN (very thin quad flat no lead) assembly with Sn-Ag-Cu lead-free solder and Ni/Au board finish was tested under three-point and four-point cyclic bend at room temperature (25degC) and high temperature (125degC). Correlation between three-point and four-point bend was performed. It was found that the cycle to failure increases significantly with displacement ranges decreasing for...
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