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Al/Cu joint was widely used in the industries, such as refrigerator, cable, air condition and CPU radiator etc. Sn-9Zn-XNi lead-free solders were used to join Al and Cu in this study. Tiny Zn and coarsened Ni5Zn21 phases distributed in the Sn matrix of the bulk Sn-9Zn-XNi solders and the amount of Zn decreased while that of Ni5Zn21 phases increased with the increasing Ni addition. The wettability...
The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear strengths with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After addition of nano Ni powder in Sn-based lead-free solders, there was no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn phase was observed...
In recent years, environmental concerns have attracted more and more attention in many countries due to poisonous elemental of Pb in the traditional lead-based solders. Many countries are about to prohibit the use of lead-bearing solders in microelectronic packaging. Replacement of tin-lead eutectic solders has become a worldwide trend. Among the candidate lead-free solders, SnAg and SnAgCu are the...
Two kinds of lead-free solders derived from tin-based nanopowders were fabricated. One was the lead-free solders with Sn-Ag-Cu nanopowders, and the other was nano-sized Cu6Sn5 doped Sn-Ag-Cu solders. The lead-free solders with Sn-Ag-Cu nanopowders were synthesized by chemical precipitation with NaBH4. The isolated particle exhibited a near spherical shape with particle sizes around 5 nm. The primary...
The drive for lead-free solders in the microelectronics industry presents some new reliability challenges. Sn-Ag-Cu alloys are leading candidates for lead-free solders. Compared to traditional Sn-Pb solders, Sn-Ag-Cu solders are easily corroded in corrosive environment due to their special structure. The presence of Ag3Sn in Sn-Ag-Cu solders accelerates the dissolution of tin from solder matrix into...
SnAgCu alloy, which promises compatible properties with Sn-Pb solder, has been identified as one of the most potential Lead-free solders for electronic interconnections. However, due to the miniaturization of solder joints, a micro-joint of this material contains only few grains. In this case, the mechanical behaviour of solder alloys shifts from the polycrystal-based to single-crystal based. Since...
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