The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this paper, a heat spreader attachment with indium solder for high-power flip chip-in-package application was investigated. The Cu heat spreader was metallized with Ni/Au and the flip chip die backside metallization was Ti/Au. A low voiding attachment process was achieved with vacuum soldering. The Au thin film was converted into AuIn2 completely after initial soldering, but no intermetallic compund...
Low-melting solder alloys are considered as one approach to lower assembly process temperature and therefore thermal stress on temperature sensitive component materials. In this study the reliability of 100 mum-solder bumps of low-melting Bi- and In-alloys has been investigated on a thin-film Al2O3 substrate (18 times 14 mm2) with more than 5000 I/Os. Two different bumping processes have been assessed:...
Chip to substrate interconnect density is continuously being scaled down to support the rapidly decreasing minimum feature size of IC components. At very fine interconnect pitches not many chip to substrate interconnects can meet the requirements of reliability and performance. One potential solution to improve the interconnect reliability is the use of compliant structures as interconnects. In this...
Copper heat spreaders are often used in flip chip in package construction. While providing high thermal conductivity, Cu has a significantly higher coefficient of thermal expansion than Si. In this work, two heat spreader attachment materials, indium for high power and polymeric adhesive for medium power applications, have been investigated. For In solder based attach, the Cu heat spreader was metallized...
Electromigration and thermomigration behaviors of eutectic tin-lead solder joints were studied above 100 degC with the currents ranging from 1.6 A to 2.0 A. The local temperature of the chip was deducted according to temperature coefficient of resistance. Also, this temperature was inspected by a thermal infrared mapping technique. It is suggested that the heat accumulation within first-level solder...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.