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Mathematical model of electromigration in terms of vacancy concentration is studied analytically and numerically in this paper with the combined effect of vacancy gradient (Fickian term) and electric flow. A 2-D, L-shaped, homogeneous material model with perfect blocking boundary condition (J = 0) is chosen as the problem of interest. Dandu and Fan have shown that current density singularity exists...
Because of the pinch-off effect, filling high aspect- ratio, void- and seam-free through-silicon-vias (TSVs) using damascene copper electroplating is one of the technical challenges in realizing 3-D integration and packaging. This paper presents simulation investigation and experimental verification of bottom-up copper electroplating (BCE) to verify its capability in fabricating high aspect-ratio...
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