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An array of accelerated temperature cycling (ATC) finite element (FE) simulations using ANSYStrade, and drop-impact finite element simulations using LS DYNAtrade, are used to find the optimum elastic modulus and coefficient of thermal expansion (CTE) for a stacked chip scale package. For the ATC simulations, Anand's constitutive model with properties for Sn96.5Ag3.0Cu0.5 (SAC305) and tin-lead eutectic...
In this paper, a non-linear analysis is performed in detail to study the effect of package architectural attributes such as die thickness, die size, substrate thickness, substrate size and passivation opening (PO) size on the stress induced in the bump during reflow process is studied in detail. A commercially available finite element analysis tool is used to evaluate the stresses induced in the bump...
The paper focuses on influence of materials properties and molding processes parameters on warpage of bimaterial silicon-molding compound (MC) systems. The three different MCs of different glass transition temperature Tg and different coefficients of thermal expansion (CTE) were considered in numerical and experimental investigation. The post molding processes and their influence on warpage were analyzed...
The effect of thinning down the chip thickness, will affect the stress pattern in the chip and causes the chip to deform locally when the thickness of the chip is thinner than a certain critical value. Such a local deformation may cause sharp gradient of residual stress around the solder bumps and thus, various failures. This paper shows that by considering the effect of solder bumps on a 50 mum chip,...
Mechanical property of laminated composite plate, such as substrate and printed circuit board are critical in package mechanical modeling, especially for package overall response and die stresses. These laminates are often orthotropic materials, which has a set of 9 independent parameters. Layers in the laminates may consist of different materials. Material composition and distribution patterns affect...
A significant need exists for the determination of critical stress characteristics within the low-cost overmolded flip-chip (OM-FC) packages. A systematic stress analysis is reported to investigate the OM-FC package for the optimal design of package geometries, materials combinations during the attachment, and thermal testing processes. A parametric study is conducted seeking the best package performance...
A finite element modeling scheme to analyze the combined effect of thermal and hygroscopic deformation is presented. The scheme employs the conventional moisture diffusion and heat transfer analysis capabilities available in the commercial FEM packages, but a new formulation is introduced to allow the time-dependent non-linear analysis of package deformations induced by hygroscopic as well as thermal...
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