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Bias Temperature Instability (BTI) causes significant threshold voltage shift in MOSFET using Hafnium-dioxide (HfO2) High-k dielectric material. Negative BTI and Positive BTI are two types of BTI effects observed in p-channel and n-channel MOSFET. BTI affects the stability and reliability of conventional six transistor (6T) SRAM design in nano-scale CMOS technology. Eight transistor (8T) and Ten transistor...
This paper presents an overview of the technological challenges facing the future scaling of device dimensions needed to meet the performance scaling in accordance with Moore's law. A number of performance boosters have to be introduced in order to keep up with the expected performance gain in each new technology node. The introduction of strain engineering is an important feature as well as the implementation...
Saturation of CMOS performance has been evident in the present 45/32 nm technology node, because of a variety of physical limitations on the miniaturization. Thus, channel engineering, including the enhancement of drive current due to high mobility channel materials and with robustness against short channel effects and characteristic variation due to multi-gate structures, has currently been recognized...
This paper describes the fabrication process and device performance of CMOSFET with direct silicon bonded (DSB) substrate. This works offers the first comprehensive evaluation of source/drain engineering for DSB devices. Scanning spreading resistance microscopy (SSRM) technique reveals specific dopant profile that lateral diffusion along the bonding interface, in addition to the highly activated dopant...
Intrinsic MOSFET time delay is examined as a function of scaling of high-performance CMOS technology. An analytical expression is used to calculate delay from physically meaningful transistor characteristics, which are either obtained from the literature or projected forward. The key performance parameter is the calculated virtual-source carrier velocity in the channel which is shown to be responsible...
In this work, two different methodologies are used to quantitatively evaluate devices with metal high-k gate dielectrics for their scaling benefits over conventional polysilicon gate devices. For each method, device characteristics and ring oscillator delay calculations are performed. Our results show that aggressive channel length scaling continually provides transistor performance gain with the...
The outlook of performance scaling in high-performance CMOS is explored by using an analytical expression for the intrinsic MOSFET delay. The historical trend of carrier virtual source velocity, as the main driver for continuous performance increase in the past, is presented and prospects of further velocity increase in future technology nodes are discussed. An optimistic scaling scenario with realistic...
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