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Increasing cost of gold (Au) for bonding wires and decreasing die and, therefore, bond pad size raise the demand for alternative bonding wire materials. A cheap alternative with good electrical conductivity is copper. Cu wire is harder than gold and aluminium. The material itself shows a pronounced strain hardening, so that the hardness increases significantly during ball bonding. These mechanical...
In this paper, we investigated the degradation mechanism and the reliability behaviors of flip chip joint using anisotropic conductive adhesives (ACAs) and Au bumped chip under high current density. The current carrying capability and current stressing reliability of flip chip assembly using three different types of ACAs were performed to investigate the effect of thermal conductivity of ACA and the...
We studied on ultrasonic bonding of Au bumps. Recently some commercial bonding machines that are furnished ultrasonic vibrator have been developed. In these machines bonding temperature can be decreased drastically. Many Au bumps (width 50 mum) were made on Al pads using photo-lithography technology. Three kinds of UBM (under bump metal) that Ti evaporation, Cr evaporation, and the non-electrolyzed...
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