The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Thermal stresses have a significant impact on the mechanical integrity and performance of RF hybrid circuits. To minimize this impact, a series of spray deposited Si-Al alloys were evaluated for use in electronic housing applications. Current housings for RF modules in space-based applications are generally made from either Kovar or 6061 Al. Although Kovar has a coefficient of thermal expansion (CTE)...
Three-dimensional (3D) integration of electronics and/or MEMS-based transducers is an emerging technology that vertically interconnects stacked dies using through silicon vias (TSVs). They enable the realization of devices with shorter signal lengths, smaller packages and lower parasitic capacitances, which can result in higher performance and lower costs of the system. This paper presents a novel...
The successful packaging and electronics integration of large 2D array devices with small pitch-sizes, such as fully populated 2D ultrasonic transducer arrays, require a flexible, simple, and reliable integration approach. One example for such electronics integration is based on through silicon vias (TSVs) with under-bump metallization (UBM) stack for solder bumping. In this paper, we demonstrate...
For the demand of multi-function and higher performance in electronic devices, the three-dimensional chip stacking technology with fine pitch and high input/output (I/O) interconnections has emerged recently. In addition, with the joint size becoming smaller, the current that each solder bump carried continues to increase, resulting in high current flowing in each individual joint. Therefore, electromigration...
This paper presents a process study dedicated to packaging using film transfer technology. The key points of this process are the nickel micromoulding step for the formation of the protective caps, the bonding and separation steps from the protective caps to carrier wafer. For this process, lines of photosensitive BCB are used as intermediate adhesive material between the host wafer (supporting the...
Three methods for fabricating thin film capacitors are investigated using sputtering, sol-gel, and atomic layer deposition (ALD) techniques for advanced packaging applications for embedded capacitors. In particular, the microstructures and the electrical properties of ceramic oxide films Au/Ti/Al2O3 for ALD are being studied while ferroelectric thin films Au/Ti/BaTiO3 for sol-gel and Cu/Ba1 - xSr...
A human body environment has a very composite chemical temper, which includes cations of metals, anions of salts and organic acids. Degradable processes that arise in this medium between biological system and implanted metallic modules chosen as biomaterials by the reason of superior mechanical properties that allow them to be used in load-applications can be harmful and must be explained. The standards...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.