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In this paper, a method of design-for-reliability for the advanced electronic package under temperature cycling (TC) condition is demonstrated, including material characterization, reliability test, finite element analysis (FEA), and fatigue life model development. Tensile tests are conducted for Sn–1.0Ag–0.5Cu–0.02Ni (SAC105Ni0.02) solder alloy at four stain rates of $10^{{-5}}$ , $10^{{-4}}$ ,...
In order to increase the fatigue life of chip resistor, it is necessary to optimize the shape of solder joints. Shape and fatigue life of chip resistor solder joint were predicted by using finite element analysis methods. Through changing the solder volume, four typical solder joint shape prediction were conducted, and three-dimensional mechanical model of fatigue life analysis was set up. The distribution...
This paper presents the measurement of decarburization of steel rods with an electromagnetic sensor using an analytical model. Loss of carbon (decarburization) at the steel surface can have a significantly detrimental effect on mechanical properties of products, since hardness, fatigue, strength, and wear properties are strongly dependent on carbon content. Currently, measurement of decarburization...
In this paper we review the mechanical properties and reliability results of stretchable interconnections used for electronic applications. These interconnections were produced by a Moulded Interconnect Device (MID) technology in which a specially designed metal interconnection if fully embedded with an elastic material such as polyurethane or silicone. In order to get a first impression of the expected...
The low-k materials have intrinsically lower modulus and poorer adhesion compared to the commonly used dielectric materials. Thus, thermo-mechanical failure is one of the major bottlenecks for development of a Cu/low-k larger die flip chip package. Furthermore, underfill selection for a Cu/low-k larger die package is also a challenging issue. In this paper, a two-dimensional finite element analysis...
With the relentless trend in ever-increasing number of I/Os on packages and the decreasing pitch of interconnects on packages, the task of modeling the fatigue life of the interconnects is becoming evermore challenging. This paper presents a RVE hybrid slim sector model which could be employed to meet the challenge. In this model, almost all the interconnects between chip and substrate are replaced...
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