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Many semiconductor devices require very high thermal performance, especially the automotive industry. Die attach material selection is a critical segment for achieving high thermal performance and stringent reliability requirements. The stringent reliability requirement at high temperature and long operating hour test is needed to test the robustness of the device and its package. Typically, solder...
Some discrete power packages require very stringent die attach requirements such as overhang die on upset leadframe. This type of packages shows physical weak point at the epoxy layer whereby reliability stress easily propagate separation near the junction of overhang die and leadframe upset curvature. Normal solution of implementing treated leadframe was not feasible because there was very little...
In this paper, high reliability epoxy encapsulating compound (EMC) suitable for a power device working at a high temperature is reported. Driven by Miniaturization of module, cost reduction by the simplification of cooling system, Tj temperature of the power module is a tendency to rise. Corresponding to this tendency, EMC is needed high heat resistant performance such as heat cycle test (TCT) and...
Despite the introduction of newer die attach adhesive material such as die attach films, conventional die attach epoxy remains to be the most important material for die attach process in semiconductor packaging. In response to the demand for high bonding strength and thermal dissipation while maintaining good manufacturability, the requirements on the behavior and characteristics of the epoxy are...
The components used in the automotive environment are subjected during their lives to various environmental combined stresses. The predominant failure mechanism at the package level due to these combined stresses is the ball bond lift. The failure is due to the combination of metallurgical effects, such as the intermetallic (IMC) Au-Al thickness growth, widening of Kirkendall voids and mechanical...
Interconnect technology is the key to the reliability of electronic devices. Electronic components are soldered to a printed circuit board (PCB). Major failure mode is thermal fatigue of solder joints since there is a big difference in the coefficient of thermal expansion (CTE) between soldered components. Underfill resin is used to improve the interconnect reliability. Resin can relief stresses in...
Interconnect technology is the key to the reliability of electronic devices. Electronic components are soldered to a printed circuit board (PCB). Major failure mode is thermal fatigue of solder joints since there is a big difference in the coefficient of thermal expansion (CTE) between soldered components. Underfill resin is used to improve the interconnect reliability. Resin can relief stresses in...
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