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Three dimensional (3D) IC integration technologies have become essential as the market demands for product with low power consumption, multi functions, smaller size and faster response have been increasing. 3D stacking with conventional high melting temperature solders such as SnAg and Sn may induce high thermal stress to the package. In this paper, chip to chip 3D stacking using no flow underfill...
The influence of the standoff height, pad size and isothermal aging on the microstructure and shear fracture behavior of Cu/Sn-3.0Ag-0.5Cu/Cu BGA structured interconnects were investigated using the lap-shear test. The experimental results show that the thickness of intermetallic compounds (IMC) layer at the solder/Cu interface increases with decreasing standoff height of the joints. The size of Kirkendall...
Thermomechanical fatigue (TMF) resulted from the mismatch in the coefficient of thermal expansion (CTE) between solder and substrate would degrade the mechanical properties of solder joints during service. In this research, nano-structured polyhedral oligomeric silsesquioxane (POSS) reinforcing particles were incorporated into a promising lead-free solder, eutectic Sn-3.5Ag solder, by mechanically...
Considering that the mechanical behavior plays a very important role in the packaging reliability, this study examined the shear deformation properties of pure Sn joints with different substrate materials and various gap sizes. The proeutectic Sn dendrites were refined and the shear strength was increased with a shrunken sample gap. The interfacial intermetallic compounds (IMCs) were thickened slightly...
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