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A silicon based THz substrate integrated waveguide (SIW) bandpass filter with a pair of antipodal linearly tapered slot Antennas (ALTSA) is designed and fabricated with MEMS process. A prototype with passband range 350GHz~370GHz is measured by using a quasi-optic measurement system. The measured data are in agreement with the simulated results, which show the filter has good selection performance...
This work presents a co-planar patch array on silicon/benzocyclobutene (BCB) with polymer-filled cavities operating at 135 GHz. Backed by a polymer-filled cavity, a single co-planar patch can achieve gain enhancement of 2 dB. The presence of the polymer in the cavity also improves the mechanical stability of the overall structure. The measured impedance bandwidth reaches up to 18 GHz and 17 GHz for...
A new additive ultra-thin chip fabrication process is presented, utilizing an array of vertical anchors that mechanically connect silicon membrane chips to a standard silicon wafer. The process is demonstrated down to 8 μm silicon chip thickness, with a chip thickness control better than ±0.2 μm and a surface topography with average roughness <; 7 nm. Such pre-processed wafers can be used for CMOS...
In this paper, we present the design and fabrication of 3-D silicon micro-arrays consisting of a wide range of isotropically-etched cavities and describe a model based upon their shape to investigate the influence of the etched features on cell trapping within cavities. We performed our study using non-invasive (MCF10A) and invasive (MDA-MB-231) breast cells separately and in a co-culture system....
The silicon wafer accounts for about half of the photovoltaic module cost. We believe two aspects are essential to reduce considerably the "wafer" costs: the feedstock issue and ribbon technology. In the SDS process the pre-ribbons are grown directly from silane by fast CVD process and followed by zone melting recrystallization (ZMR). In this paper a new generation of fast CVD reactor to...
Plastic electronics, thin-film-transistors on foil and ultra-thin chips on foil are technologies currently pursued to support the strongly emerging market for flexible electronics. Ultra-thin CMOS chips in such systems will provide solutions whenever high circuit performance and/or complexity are required. Ultra-thin Si chips (6 to 20 mum) are fabricated by using a recently introduced technology based...
As performance gains from scaling silicon slow, improvements in system performance must come from tighter integration. Proximity communication (PxC) enables designers to aggregate multiple chips that perform as a single large piece of silicon. PxC enables the heterogeneous integration of an optimized mix of process technology and functionality, such as DRAM, flash memory, and CMOS processor chips...
A technology was developed for the fabrication of very thin, chip-sized lithium secondary micro batteries. Based on wafer level processing the batteries can be directly implemented into silicon chips, 3D chip stacks or MEMS devices. The batteries were packaged in 200 mum deep cavities of the silicon wafer and encapsulated with a glass substrate. Battery demonstrators with 7 and 12 mm2 and round foot...
System integration is clearly a driving force for innovation in packaging. The need for miniaturization has led to new system in package (SiP) architectures, which combine a whole range of different technologies. However, cost is the critical issue in SiP packaging as individual operations are currently necessary to complete each individual package. Taking into account all the developments that have...
Surface-normal ultra-compact narrowband optical filters and broadband reflectors can all be realized via Fano resonances on patterned single layer silicon nanomembranes (SiNM) layers on SOI. Recently, we reported Fano filters transferred onto glass or flexible polyethylene terephthalate (PET) substrates, employing a low temperature wet-transfer process. Here we report demonstration of broadband reflectors...
We propose many-element cascaded-resonator devices with gapless non-evanescent inter-cavity and waveguide-to-cavity coupling using double-notch-shaped microdisk resonators. We demonstrate such devices with up to 50 elements in a silicon nitride-on-silica substrate.
We report the development and application of a novel scanning probe array that consists of "blunt" and "sharp" tips with precisely defined contact areas. A new micromachining process based on SOI (silicon-on-insulator) substrates has been successfully developed to enable the fabrication of the scanning probe array. To demonstrate its capability for variable-resolution scanning...
Monte Carlo (MC) simulation of thin oxide evaporation from silicon surface was carried out. Including in MC model chemical reactions of creation and dissociation of silicon monoxide during annealing makes it possible to simulate evaporation of a thin oxide layers. It was shown, that defects in the oxide matrix provoke starting of the layer dissociation processes.
In the domain of manufacturing and packaging of micro-system, the Pyrex7740 glass is a widely-used material since its coefficient of thermal expansion is similar to that of silicon, and its good optical performance for biosensors and optical sensors. But the use of Pyrex7740 glass is limited for its isotropic etching characteristic of tradition micro-machining. In this paper, we present a new process...
We present design and fabrication of two-dimensional photonic crystal cavities made in nanoporous silicon luminescent at 700-800 nm. Enhancement in photoluminescence extraction efficiency at the resonant wavelength is expected due to Purcell effect.
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