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This paper describes a versatile and reliable wafer-level hermetic packaging technology using an anodically-bondable low temperature cofired ceramic (LTCC) wafer, in which electrical feedthroughs and passive components can be embedded. The hermeticity of vacuum-sealed cavities was confirmed after 3000 cycles of heat shock (-40°C/+150°C, 30 min/30 min) by diaphragm method. The width of seal rings necessary...
This paper discusses the design and realization of a micromachined micro Coriolis flow sensor with integrated electrodes for both electrostatic actuation and capacitive readout. The sensor was realized using semicircular channels just beneath the surface of the silicon wafer. The channels have thin silicon nitride walls to minimize the channel mass with respect to the mass of the moving fluid. A comb-shaped...
Self-assembly of colloidal particles has an advantage of low cost, high productivity and applicability to various devices. The capability of assembling nano-scale particles on three dimensional structures can extend the fields of application, such as high-sensitivity gas sensors and bioassay devices with surface-functionalized particles. We demonstrate such assembly where monolayer polystyrene particles...
Wafer level bonding is widely applied in the manufacture of sensors, actuators and CMOS MEMS. Bonding technology includes direct bonding, anodic bonding, eutectic bonding, adhesive bonding and glass frit bonding. Glass frit bonding has pattern-able, excellent sealing performances, high bonding strength, don't need apply any voltage during bonding process and less CTE mismatch compared to glass and...
This paper describes the two different integrated fabrication process flows for microelectromechanical systems (MEMS) accelerometer with surface micromachining technology at Analog Devices (ADI). Each method has its own identity with several advantages and disadvantages with respect to each other. CMOS-MEMS are fabricated using silicon-on-insulator (SOI) substrate, which allows the monolithic integration...
In this paper, a novel MEMS antenna array is presented. It can be fabricated on a single silicon wafer without any need for wafer bonding or hybrid integration. The proposed array is of the wire-grid type, namely a "brick-wall" structure. Such array can be built by connecting a number of radiating wires via a number of connectors. Unlike the regular arraying technique, the radiating elements...
In this paper, we have fabricated a new microphone using aluminum (Al) slotted perforated diaphragm and back plate electrode, and photoresist (AZ1500) sacrificial layer on silicon wafer. The novelty of this method relies on aluminum diaphragm includes some slots to reduce the effect of residual stress and stiffness of diaphragm for increasing the microphone sensitivity. The acoustic holes are made...
The goal of this article is to study the etching properties as a function of various adsorbed surfactant thickness in wet anisotropic etching process of TMAH solution. The thickness of preferentially adsorbed surfactant molecules on Si{110} and Si{100} has been evaluated by using spectroscopic ellipsometry (SE). The dependence of the etch rate in TMAH and the surface roughness on the layer thickness...
This paper reports a hermetic MEMS package structure with silicon wafer as bonded cap at wafer-level scale. CMP followed by spraying chemical smoothing process is utilized to thin the N(100) silicon cap wafer to the thickness of 150 mum after wafer-level Cu/Sn isothermal solidification bonding. Method for the thinning process and parameters for Cu/Sn isothermal solidification bonding process are researched...
The purpose of this paper is to apply characteristics of residual stress that causes cantilever beams to bend for manufacturing a micro-structured gas flow sensor. This study uses a silicon wafer deposited silicon nitride layers, reassembled the gas flow sensor with four cantilever beams that perpendicular to each other and manufactured piezoresistive structure on each micro-cantilever by MEMS technologies,...
This paper reports on the mechanical characterization of thin films using the microtensile technique performed for the first time at the wafer-scale. Multiple test structures are processed and sequentially measured on the same substrate, thus eliminating delicate handling of individual samples. The current layout uses 26 test structures evenly distributed on a 4-inch silicon wafer, each of them having...
Micromachining is an extended IC fabrication based on photo-fabrication, deep etching, anodic bonding and other advanced process technologies. This is used to produce MEMS (Micro Electro Mechanical Systems) featuring multi-functions, small size and low cost. Nanostructures such as CNT (Carbon Nano Tube) can be also included in the MEMS by nanomachining. MEMS are used as value added key components...
This paper presents an application of micro glass blowing, in which multiple glass spheres are simultaneously shaped on top of a silicon wafer and subsequently filled with rubidium. The fabrication process is based on etching cavities in silicon, followed by anodic bonding of a thin glass wafer to the etched silicon wafer. The bonded wafers are then heated inside a furnace at a temperature above the...
In this paper, we describe our experience with deep reactive ion etching (DRIE) of silicon to depths ranging from 10 mum to more than 250 mum for MEMS applications, including MEMS microphone. The DRIE was produced in oxygen-added sulfur hexafluoride (SF6) plasma, with sample cooling to cryogenic temperature. We used an inductively coupled plasma reactive ion etcher and Al mask. A 90 min etching experiments...
The design and fabrication for a novel silicon-based micro direct methanol fuel cell (mu-DMFC) of 0.64cm2 active area on <100> silicon wafer are described in this paper. The novelty of the DMFC structure is that the anodic micro channels arranged in the asymmetric mesh have been fabricated, and the first objective of the experimental trials is to verify the feasibility of the novel structure...
In this paper, the development of a low cost 4-channel coarse wavelength division multiplexer (CWDM) splitter is reported. The CWDM splitter consists of 3 thin film filters (TFF), 4 high reflection micro-mirrors (MM) and 4 ball lenses (BL) which are all assembled on a silicon optical bench (SiOB). The configuration of the CWDM splitter is modeled in three dimensional space by using commercial optical...
In this paper, we propose a novel method to fabricate three-dimensional hexagonal-like fillister structures on lang110rang silicon wafer by precise bulk etching in micro electro mechanical systems (MEMS). Photo mask is designed as a 50 times 50 array of equilateral parallelograms having side length of 80 mum. The 40 wt% KOH solution is used as the etchant. The created structure is used as the mold...
The summary form is given. Femtosecond laser micromachining of variety of materials has been pursued by several research groups for possible improvements due to the extremely short pulse width of the laser. We have used a Spectra Physics 2 mJ laser to explore the micromachining at submicron dimensions. The laser wavelength was 800 nm and was frequency doubled using a LBO crystal. An almost gaussian...
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