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Ensuring reliability of interfaces of dissimilar materials is one of the most critical design aspects of electronic assemblies. A study on the interface delamination phenomenon of different power packages was undertaken. Thermally induced stresses caused by the thermal mismatch between molding compound (MC), Si-die, and Cu- heatsink act as combined shear and normal loadings on the respective interfaces...
Mechanical simulation and modeling play increasingly important roles in semiconductor industry. It provides guidelines on material selection, package geometry configuration, and package platform selection. It also provides insights and predictions on package reliability and failure mechanisms. Many mechanical models on reliability and failure issues aim directly at observed failures, such as solder...
The increased functionality of cellular phones and handheld devices requires system level integration. Thus there is a strong demand in cell phone maker to move to embedded micro wafer level packaging (EMWLP). But the major problem encountered is die shift during compression molding. This paper presents a novel method to predict the die shift during wafer level molding process. A series of parametric...
Commercial FEM software codes do not directly support the cure dependency of polymers behavior. In electronics packaging, for example, cure shrinkage of the molding compound is consequently treated as a surplus to thermal contraction and its changes in visco-elastic behavior during curing are usually ignored. This give rise to inaccurate results and may cause difficulties even in recognizing factors...
The paper focuses on influence of materials properties and molding processes parameters on warpage of bimaterial silicon-molding compound (MC) systems. The three different MCs of different glass transition temperature Tg and different coefficients of thermal expansion (CTE) were considered in numerical and experimental investigation. The post molding processes and their influence on warpage were analyzed...
Mold compound, substrate core, solder resist, underfill and die attach materials have been used for semiconductor packages for a long time. Recently, 3D packages (such as package-on-packages, stacked-die-packages) were introduced in the electronics industry. Moreover, pursing ultimate performance requires package body downsizing more and more. 3D packages are achieved by stacking laminate substrate...
It is well-known that high thermal stresses induced interfacial delamination is a typical failure mode in multi-layered micro-electronic components. Therefore, it is a key factor in package design to minimize interfacial stresses to enhance package reliability. In this paper, two designs of TAPP with different die attach pastes were manufactured. It was found that some test vehicles had cracks near...
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