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In this paper the effects of chemical and electrical driving forces on the evolution of interfacial reaction layers in lead-free solder interconnections are discussed. Firstly, the effects of alloying and impurity elements on the driving forces for diffusion in the Cu-Sn system are analyzed. These results are then used to predict the subsequent changes in the intrinsic fluxes of the elements. It is...
In this paper, tin whisker behaviour of electroplating tin coating was studied in different environments. Different thickness of electroplating tin coating on copper substrate had been tested. Two different environmental conditions had been applied :one temperature tests (70 °C)and one external force tests(70 °C /17.5N). The growth of tin whisker was studied by using scanning electron microscopy (SEM)...
In this paper, tin whisker behaviour of electroplating tin coating was studied in different environments. Different thickness of electroplating tin coating on copper substrate had been tested. Two different environmental conditions had been applied :one temperature tests (70 °C)and one external force tests(70 °C /17.5N). The growth of tin whisker was studied by using scanning electron microscopy (SEM)...
The whisker formation behaviors of Sn3.0Ag0.5Cu composite solder which reinforced by an organic-inorganic hybrid materials, silanol of polyhedral oligomeric silsesquioxane (POSS-silanol) was investigated. The thin solder films were obtained by reflow soldering and a thermal cycle from −40°C to +85°C was applied to accelerate the test process. Both surface and interface microstructures of the specimens...
Cu pillar bumps are known to be one of the most promising candidates for the fine pitch interconnection materials because they do not cause bump bridging between adjacent bumps.[1] Also, Cu pillar bump is widely adopted as chip-to-substrate or chip-to-chip interconnect in 3D integration as well as flip chip package [2]. However, Cu pillar bump makes excessive intermetallic compound (IMC) and Kirkendall...
The processes involved with dynamic welding of contacts are discussed and two different welding mechanisms are identified from work using a very sensitive model switch. One mechanism forms weak welds by cold bonding freshly arced surfaces and the other mechanism involves bonds formed by short arc melting of the contact surface. Using the model switch, silver tin indium oxide contacts having different...
For automotive applications, the mechanical behaviour of the contact area under vibrations is one of the key factors for connector reliability. Such vibrations are typically in the range of 10-2000 Hz and result in displacements of only a few microns, at the contact interface. In the present study, a bench test has been developed to control more representative motions down to 1 μm. The objective is...
Structural and electrical properties of nanostructured materials for optoelectronic and gas sensors have been studied by atomic force microscopy (AFM). The original technique, based on combined conductive AFM, allows analyzing of electrical properties with high lateral resolution. This technique was applied for conductance and homogeneity study of In nanoislands formed on monocrystalline PbTe on Si...
Tendon-based transmission systems present many positive aspects and greatly simplify the mechanical design of small robotic devices, such as robotic fingers. On the other hand, they introduce several nonlinear effects that must be properly considered by the control algorithms to achieve a suitable performance level in the regulation of the finger joint torques. In this paper, the model of the tendons-based...
Since the very beginning of the flash memory era, the market has been dominated by the floating gate technology. However, as floating gate flash continues along a very steep scaling path, more and more barriers start to appear, limiting further scaling possibilities of the technology. At the same time, other concepts are preparing to take over. This paper concentrates on the prospect of high-k materials...
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