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Expanding FOWLP (Fan-Out Wafer-Level Packaging) from mainly 2D single or multi die solutions to 3D stacked multi-die solutions with SMDs integration, is of crucial importance to meet the requirements arising from new markets such as IoT/IoE and Wearables. This drives the development of new capabilities and technology breakthroughs in the current FOWLP process. One of the most hailed capabilities of...
3DIC technology has enabled scaling beyond the Moore's Law to achieve higher transistor count, increased functionality and superior performance. Additionally, this technology allows integrating heterogeneous components such as Processor, FPGA, GPU, Memory, Serdes, etc. on the same interposer die enabling faster computing through reduced latency. The yields on the 3DIC technology have matured and are...
Recently, the electronics industry is moved maturely on the mobile/tablet market. The next fast growing opportunity market will be the Internet of Things (IoT) and Wearable Deivces in the near future. This advanced technology/package need to provide the ideal solution for small form factor, thin profile, high electrical performance, multi-function integration and low cost are the most critical requirements...
The recent development trend of smaller flip chip packages requires narrower gaps and smaller pitches. The capillary type underfill is still mainly used for the flip chip mass-production process. The Non-Conductive Paste (NCP), which is applied before chip attachment, has been introduced for fine pitch applications. These pre-applied type underfills have some advantages, such as no need for dispensing...
The market of Connectivity, Internet of Things (IoT), Wearable and Smart industrial applications leads Fan Out Wafer Level Package (FOWLP) technologies to a promising solution to overcome the limitation of conventional wafer level package, flip chip package and wire bonding package in terms of the solution of low cost, high performance and smaller form factor packaging. Moreover, FOWLP technology...
A novel bonding approach for flexible substrate vertical stacking is proposed in this paper. Unlike the traditional anisotropic conductive/non-conductive paste/film used in flexible substrate bonding, the metal thin film is adopted as bonding material in this approach. Experiment results show that the novel bonding approach has good electrical properties and reliability performances. The innovative...
This paper compares the attributes of the embedded wafer level BGA (eWLB) and a flip chip package structure, called Fan-Out Chip Last Package (FOCLP). The comparison involves a study in finite element modeling, advanced warpage metrology, reliability testing and physical structure comparisons. The purpose of this study is to understand the similarities and differences between these two package structures...
A powerful integrated fan-out (InFO) wafer level system integration (WLSI) technology has been developed to integrate application processor chip with memory package for smart mobile devices. This novel InFO technology is the first high performance Fan-Out Wafer Level Package (FO_WLP) with multi-layer high density interconnects proposed to the industry. In this paper we present the detailed comparison...
The decreasing size of solder joints leaves limited tolerance of allowable warpage range for successful assembly. Understanding the electronic packages' behavior during the reflow process becomes one of the most important tasks in developing assembly process and assuring reliability. Three-dimensional (3D) digital image correlation (DIC) plays an important role in quantifying warpage of BGA packages...
In the present article, we report a breakthrough approach for the rapid growth of whole void-free and highly preferred orientation Cu6Sn5 IMC interconnects of 50 µm thick by the current driven bonding (CDB) interconnect method and the use of a single crystal seeding substrate. There was no grain boundaries within the Cu6Sn5 IMC interconnect and no voids at both interfaces, which is beneficial for...
Our 3D stacked CMOS image sensor (CIS) has an ideal global shutter function with 16 million pixels and 4 million micro-bump interconnections placed at a 7.6-εm pitch between two silicon substrates, achieving interconnections with very low resistance. We confirmed the reliability of our 3D stacked interconnection technology by conducting reliability tests, which included heat cycle tests and high temperature...
Three-dimensional integrated-circuit (3D IC) is one of the most important electronic packaging technologies nowadays. Cu-to-Cu through-silicon-via interconnection is a crucial process in 3D IC. Direct Cu-to-Cu bonding has been a challenging process for the industry due to its strict requirements on processing conditions and corresponding high processing costs. Micro-bumping is a widely used method...
Through Silicon Via (TSV) plays a key role in accomplishing 3D IC integration. In most common approaches, TSV is filled with copper. Due to large mismatch in Coefficients of Thermal Expansion (CTE) between the copper via and the silicon of TSV, significant thermal stresses will be induced at the interfaces of Cu/dielectric layer (usually SiO2) and dielectric layer/Si, which would lead to various reliability...
A 3D system-in-package (SiP) module for pakage-on-package (PoP) application base on the commercial multi-layer printed circuit board (PCB) using BT laminated substrate is presented in this paper. To achieve the miniaturized package-level 3D SiP, double-sided SMT process and a stacked interposer as the interconnection of IO signals were selected. One ASIC and three ADC were mounted on the top of the...
This paper mainly does research about the multilayer chip embedded based on the organic substrates. On the one hand, that puts forward a new 3D package structure of the organic substrates embedded. On the other hand, we find a kind of process flow based the whole organic substrate process and solve the key process. We completed the sample and test of the single-layer chip based the multilayer chip...
A low-cost and manufacturable 3D IC substrate-less Chip-on-Wafer (CoW) package has been studied. The new structure is a result of process simplification from the production-proven Chip on Wafer on Substrate (CoWoS™) technology. It features three layers of submicron (0.8µm pitch) Cu RDL on a Si interposer. High interposer yield is ensured with the excellent FAB-grade low defect density as demonstrated...
This paper mainly does research about the multilayer chip embedded based on the organic substrates. On the one hand, that puts forward a new 3D package structure of the organic substrates embedded. On the other hand, we find a kind of process flow based the whole organic substrate process and solve the key process. We completed the sample and test of the single-layer chip based the multilayer chip...
A 3D system-in-package (SiP) module for pakage-on-package (PoP) application base on the commercial multi-layer printed circuit board (PCB) using BT laminated substrate is presented in this paper. To achieve the miniaturized package-level 3D SiP, double-sided SMT process and a stacked interposer as the interconnection of IO signals were selected. One ASIC and three ADC were mounted on the top of the...
Each new technology node brings new design and technology challenges making it harder to maintain Moore's law in a cost effective way. Maintaining cost effectiveness is becoming a major challenge for IDMs, fabless companies and foundries. 3D/2.5D technologies offer some unique advantages over traditional scaling such as higher power efficiency, higher bandwidth and heterogeneous integration which...
In this study, a 3D package module based on flexible substrate is proposed. In order to improve the thermo-mechanical reliability of the 3D package module, the simulation of the key manufacture process is more and more important. The key manufacture processes of the 3D substrate package module mainly include 2D chip assembly, under-filling, 3D substrate folding, die-attaching, molding, and ball grid...
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