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In this study three-dimensional finite analysis models of 3D micro-scale chip scale package (CSP) solder joints were set up. The stress-strain distribution of micro-scale CSP solder joints was obtained by finite element analysis under the condition of random vibration load. The influence of different solder, pad diameter and solder joint volume on the stress-strain of micro-scale CSP solder joint...
Integrated circuits (ICs) undergo dimensional reduction and the functional unit of density dramatically increases, the reliability issue becomes more critical, especially with respect to three-dimensional (3D) silicon integration technology. Through-Silicon Vias (TSVs) technology is one of the most prominent feature used for interconnecting between chips. Since TSVs contain interfaces of heterogeneous...
Accurate estimation of semiconductors' junction temperature is particularly important that the impact of the temperature on their reliability and performance is evident. The analysis in this paper reveals that the using of RC thermal network models with reduced number of layers can be tremendously useful. Additionally, a simple technique for transforming n-layer Foster model to a one-cell Cauer ladder...
A first error analysis for finite element solutions of time-harmonic boundary value problems involving cylinders moving in the axial direction is carried out. It is shown that the solutions are affected by errors which behave in a very regular way, as it happens with traditional problems and finite element simulators in the presence of motionless objects. The effects of the motion on the errors considered...
The knowledge of a historical masonry building is a prerequisite both for the purposes of a reliable evaluation of the actual seismic safety and for the choice of an effective intervention for the preservation of the monumental building. It is therefore a need to refine the investigations and techniques of analysis by different degree of reliability, as well as in relation to their impact. Knowledge...
Although coils for Inductive Power Transfer (IPT) works on the fundamental principle of Ampere's and Faraday's laws, on which conventional transformers work, there is difference in approach required for designing coils for IPT than designing a conventional transformer. Because of the complex design of some IPT coils and the increasing emphasis on the magnetic field strength of such systems, Finite...
To denote an exact form of decoupling software modules in object-oriented programming the dependency inversion principle is used. By using this principle, the conventional dependency relationships known from high-level, policy-setting modules to low-level, dependency modules are reversed which results in description high-level modules autonomous of the low-level module implementation details. In conventional...
Mechanical stress induced by mechanical and thermal loading on thin silicon devices breaks the devices at a certain load called the fracture or breaking strength of the device. The displacement experienced by the dies, due to bending, at fracture strength is called the fracture displacement. The strength properties of thin, bare silicon dies have already been reported. This work extends the study...
One of the most critical failure modes in a BGA package is the solder interconnect failure (2nd level). Conventionally, the solder damage is due to the mismatch of coefficient of thermal expansion (CTE) between the various package components and the PCB. It is absolutely critical to identify and minimize the BGA damage under thermal cycling to improve the package reliability. In the past, the critical...
Semiconductor industry has recognized the need to replace traditional Al/SiO2 interconnects with Cu/Low-k interconnects in the mainstream electronics devices following the latter's impact on power, RC delay, and cross-talk reduction. However due to lower elastic modulus, strength, and poor adhesion characteristic, reliability of the Cu/Low-k interconnects turns out to be a concern for its integration...
The dropping test of WLCSP with RDL on board-level was investigated by numerical method in this study. The asymmetric pattern of WLCSP devices mounted on the PCB board was considered. Using the finite element analysis, the stress and energy in the WLCSP with RDL was predicted under the dropping test conditions. The critical locations of WLCSP device on the PCB in the dropping test were identified...
As the demand grows for multiple functionality and high density, the reliability of plated through hole (PTH) becomes a concern because of the difficulty in small window plating. Choosing a favorable stress-strain model is an important part of PTH's reliability assessment. In this paper, the stress-strain model of Mirman and enhanced IPC (Association Connecting Electronics Industries) are considered...
Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation...
The study aims to predict the life and assess the reliability of electronic packages subject to multiple drop-impacts. Engineers used to adopt mechanics analysis as well as a certain life prediction model to predict the impact life of the package, and it is usually a deterministic value. However, drop test results show that the impact life of the package is not a single deterministic value but scatters...
This study describes board-level drop reliability of TFBGA subjected to JEDEC drop test condition which features an impact pulse profile with a peak acceleration of 1500G and a pulse duration of 0.5 ms. The solder ball is assumed as an elastoplastic model, and the other components are assumed to be linear elastic models. Both the global/local finite element method and the finite grid region method...
An electro-thermo coupling finite element model for lead free Sn4.0Ag0.5Cu (SAC405) solder ball is developed to investigate the electromigration and electro-thermo-mechanical effects on electronic packaging in the present paper. SAC405 alloy solder ball are commonly used on BGA package and POP package. In this research, a single solder ball (bump) used on flip chip package is established to evaluate...
The analysis of parametric probabilistic sensitivity analysis is important for reliability-based design, which shows changes of system reliability caused by the change of basic variances. In this paper, a fast approximate method of reliability analysis based on the commercial FE simulation-artificial neural network-Monte Carlo simulation is proposed, which can save the calculation cost with efficient...
During the design of the second-phase extension project of a fuel electric plant in China, in order to meet the technological requirements, a typical oval steel coal scuttle with double funnels was proposed. This kind of scuttle has a complicated geometrical shape and is difficult to be designed and built. To evaluate the mechanical behavior of this scuttle, the 3D finite element structural analysis...
The aim of vehicular reliability experiment is assessing its reliability, measuring its reliability index and serving for vehicular design, manufacturing and development. In this paper, we present product virtual reliability analysis method, which is based on Virtual Reality and Virtual Prototype technology. It is a software platform that integrates various engineering software and simulated algorithms,...
This paper presents the high reliability design method for lead-free solder joints on chip components, and that is able to evaluate effect of soldering process for solder joint shape. Coupled analysis of structure analysis and flow analysis was proposed for replication of solder wetting and behavior of electric components at the same time. The analysis methods enable to evaluate complex mechanism...
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