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This study presents a novel design and fabrication process to realize a miniature polymer ball bearing slide table (slider) with long linear travel range. The linear slide table consists of a pair of V-shape silicon (111) crystal plane rails, and a suspended slider supported by four polymer ball bearings. The ball-housing on slider is also designed to confine the bearing. The slider, rails, and ball-housings...
We demonstrate a pH sensor based on silicon gratings coated with thin film of hydrogels. The silicon gratings have optical sensitivities around 197nm/RIU in detecting refractive index change and 0.824nm per nanometer of thickness change of hydrogel on the surface of silicon gratings. Silicon gratings were silanized so that the hydrogel is chemically bound to its surface. Normal transmission measurement...
Fabrication of solar cells on cheap plastics, due to its demand for a low temperature processing (~100?C) needs adaptation of the cell structure of the state-of-the-art high efficiency thin film silicon solar cells made at high temperature (200?C). Use of a double n-layer (n-?c-Si/n-a-Si) instead of a single n-?c-Si layer improves Voc from a low 0.66 V to 0.82 V in the as deposited state of an n-i-p...
This paper presents low loss CPW (Co-Planar Waveguide) and microstrip via transitions on LCP (Liquid Crystal Polymer) substrate. The CPW transition using 105 mum via holes on a 4 mil LCP shows virtually no loss up to 25 GHz and about 0.13 dB of loss per transition at 40 GHz. The microstrip transition has no loss up to 15 GHz and approximately 0.5 dB of loss per transition at 30 GHz. In addition, the...
Laser assisted polymer bonding is a novel technique for MEMS packaging, which can offer a short bonding time and reduce the thermally induced stress during the packaging process. However, due to the localised nature of the temperature rise, it is difficult to monitor the temperature change precisely during the bonding process using the conventional methods. In this paper, the development of thin film...
Flexible microelectrode array (MEA) has been widely used in neural prosthesis, such as artificial retinal chip. Specially, this sort of MEA for highly efficient electrical stimulation is more urgently required. In this work, a 3D flexible parylene-metal structure was fabricated by structure transfer technique. Silicon wafer was etched by deep reactive ion etching and isotropic wet etching sequentially...
A technology was developed for the fabrication of very thin, chip-sized lithium secondary micro batteries. Based on wafer level processing the batteries can be directly implemented into silicon chips, 3D chip stacks or MEMS devices. The batteries were packaged in 200 mum deep cavities of the silicon wafer and encapsulated with a glass substrate. Battery demonstrators with 7 and 12 mm2 and round foot...
Hybrid thin-film solar cells are fabricated on the glass substrate using ZnO nanorods, well-aligned single-crystalline Si nanowires (SiNWs), and poly(3-hexylthiophene):[6,6]-phenyl-C61-butyric acid methyl ester (P3HT:PCBM) as well as micro-structured III-V semiconductors . The effect of introducing a solution-processed fullerene as an electron transport layer on the polymer/ZnO nanorod array composite...
System integration is clearly a driving force for innovation in packaging. The need for miniaturization has led to new system in package (SiP) architectures, which combine a whole range of different technologies. However, cost is the critical issue in SiP packaging as individual operations are currently necessary to complete each individual package. Taking into account all the developments that have...
In this paper, transmission line parameters such as characteristic impedance Z0, effective dielectric constant epsiveff, attenuation constant alpha of Suspended Microstrip line on multilayer low resistivity silicon substrate are investigated. Effect of variation in the thickness of Si3N4, polyimide and metal layer are studied using HFSS. Due to suspended nature, significant reduction in transmission...
We report a process for top-gate amorphous silicon thin-film transistors (alpha-Si TFTs) that employs a self-aligned metal silicide for source and drain (S/D). All process steps, including deposition of active layers and formation of metal silicide, are accomplished at temperatures that are less than or equal to 280degC. The thermal budget is compatible with flexible polymer substrates. The fabricated...
We present recent progress in converting polymer templates into three-dimensional silicon photonic crystals by using a silicon-double-inversion procedure. This has led to woodpiles with both improved structural and optical quality.
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