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Micro mirror packaging development for pico-projector application requires integration of magnets, silicon spacer and glass cap. A multilayer stack package has been designed for large deflection micro mirror. The magnets are used for electromagnetic actuation and are attached on either sides of the silicon beam by a pick and place machine. Different epoxy materials are evaluated to optimize the magnet...
The wafer level hermetic packaging is a method of sealing micro-devices containing movable parts with a capping wafer in vacuum. The capping wafer is etched to form a cavity which will cover over the MEMS devices and the process is carried out at the wafer level before the device wafer is diced. Glass frit bonding is described as the most leak proof and robust sealing mechanism of all available methods...
A novel foaming process to fabricate wafer-level micro glass objects including bubbles and runners for MEMS packaging was studied. Firstly shallow cavities were wet etched fast on the surface of a silicon wafer. CaCO3 powders were placed in the silicon cavities. Then the cavities were sealed with a glass wafer by anodic bonding. The bonded wafers were then heated up, and the gas released by CaCO3...
This paper describes the thermo-mechanical design of an advanced zero-level capping technology used for packaging of a MEMS die. The package approach uses Intermetallic Compound (IMC) bonding to seal the MEMS die with a cap, and uses Through Silicon Via's (TSV) to provide the electrical connections from the MEMS die to the second level substrate (LTCC or PCB). Advanced FEM based thermo-mechanical...
This paper presents the recent advances in the development of a laser assisted fast polymer bonding method for electronic packaging applications. In this method a high power diode laser is used to cure a polymer adhesive material to bond substrates together. A unique beam forming method using custom designed optical phase plate elements was developed to transform a fiber delivered laser beam into...
This paper presents a process study dedicated to packaging using film transfer technology. The key points of this process are the nickel micromoulding step for the formation of the protective caps, the bonding and separation steps from the protective caps to carrier wafer. For this process, lines of photosensitive BCB are used as intermediate adhesive material between the host wafer (supporting the...
The highest integration density of microsystems can be obtained using a 3D-stacking approach, where each layer of the stack is realized using a different technology, which may include sensors, imagers, rf and MEMS technologies. A key challenge is however to perform such stacking in a cost-effective manner. In this paper, a novel 3D TSV and 3D stacking technologies will be presented. Application examples...
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