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Miniaturization and simultaneous increase of complexity and functionality of modern electronic control units (ECU) leads to the situation that the classical reliability methods become less and less sufficient. Reliability prediction in automotive industry is complex, as the load history on the system level (e.g. car) is multi-domain and depends on many different factors such as the climate, the type...
A technique is presented that allows to simultaneously measure stress and deformation of packaged silicon dies. Required is a test chip with an array of Hall plates assembled in a package made of nonmagnetic materials. Exploiting the highly anisotropic magnetic sensitivity of the integrated Hall plates in an external magnetic field, makes it possible to measure the deformation. Moreover, the piezoresistive...
Stress sensing test chips are widely utilized to investigate integrated circuit die stresses arising from assembly and packaging operations. In order to utilize these test chips to measure stresses over a wide range of temperatures, one must have values of six piezoresistive coefficients for n- and p-type silicon over the temperature range of interest. However, the literature provides limited data...
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