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In present study, a backside-etched silicon chip with a polysilicon diaphragm flip-chip attached on a printed wiring board (PWB) and globally bumped on a FR4 substrate was investigated based on finite element analysis (FEA) for determining three key parameters of flip chip chip size packaging (FC-CSP), namely, the size of solder bump, the thickness of PWB substrate, with/without U8437-3 underfill...
As far as components with flip chip interconnects are concerned, one of the popular packaging solutions available in the market is thermally enhanced flip chip ball grid array (TEFCBGA) packages, which target mid to high performance applications. Traditional as it may be, the development of a reliable TEFCBGA package is still a very challenging task. The demands for high electrical performance with...
In this paper, the backward compatibility solder joints were chosen in simulation of perimeter PBGA272 assembly. A double-symmetric plane FE model of a PBGA272 was established using the software ANSYS. Based on the maximum von Mises stress and von Mises strain, the position of the most danger solder joints were obtained under thermal cycle with the temperature condition from -40degC to 125degC (JESD22-A104-B...
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