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High power light emitting diode (HP-LED) as solid-state Lighting (SSL) is a promising light source, and one of the important factors for its wide acceptance is its reliability. [l]Temperature and humidity are two key factors which affect the reliability of HP-LED. Based on the three-dimension model of Multi-chips integrated module LED (MCIM-LED), the effects of temperature and humidity on the reliability...
In this paper, the backward compatibility solder joints were chosen in simulation of perimeter PBGA272 assembly. A double-symmetric plane FE model of a PBGA272 was established using the software ANSYS. Based on the maximum von Mises stress and von Mises strain, the position of the most danger solder joints were obtained under thermal cycle with the temperature condition from -40degC to 125degC (JESD22-A104-B...
The existing automatic optical inspection (AOI) equipment can be used to check out the defect of the electronic products, such as solder bridging, tomb stone and so on. Based on the existing AOI, a new intelligent optical inspection analysis (IOIA) technology is brought forward in this paper. The method, which combines off-line analysis and on-line contrast, is employed in the IOIA technology. That...
Along with more and more use of thin-profile fine-pitch ball grid array (TFBGA) in portable electronic products, such as mobile phones and personal digital assistant (PDA), etc., the drop impact reliability of solder joints for TFBGA becomes a critical concern. This problem is more serious with the application of lead free solder because lead free solder alloy have higher rigidity and lower ductibility...
The European community has been finalized to phase out on July 1, 2006 for lead (Pb) in electronic products. This cause the EMS is required to study new materials for replacing the lead in its products. This paper presents the manufacturability and reliability study of two competitive lead-free alternatives. A series experiments are carried out, and the voids, microstructure and joint strength of...
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