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The junction-to-case thermal resistance Rth-JC is an important thermal characteristic for power semiconductor devices. Its value is often one of the main criteria for the decision whether a device can be used in a thermally demanding environment, and a low Rth-JC therefore is a competitive advantage for the semiconductor manufacturer. On the other hand the vendors must ensure that their data-sheet...
Contrary to popular belief the junction-to-case thermal resistance (Rth-JC) of a power semiconductor is not an intrinsic property of the device but depends to some extend on the cooling condition at the case surface intended for heat sinking. In addition to this the Rth-JC can be measured only with quite limited accuracy by the methods existing today. This paper investigates the dependence of the...
The standard procedure to measure the Rth-JC of semiconductor devices requires a thermocouple measurement of the case temperature while the IC-package is in contact with a water-cooled heat-sink. This method often produces wrong results since the measurement of the case temperature is quite prone to errors. Transient dual interface (TDI) measurements have been suggested as an alternative to overcome...
The accurate and reproducible measurement of the junction-to-case thermal resistance Rth-JC of power semiconductor devices is far from trivial. In the recent time several new approaches to measure the Rth-JC have been suggested, among them transient measurements with two different interface layers between the package and a heat-sink. The Rth-JC can be identified either in the structure functions or...
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