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This paper forwards two TSV positioning algorithm named middle-cut positioning (MCP) and optimized area positioning (OAP). In 3D IC placement, TSV occupies cell area and its position does affect the real wire length which is ignored in previous works. Its effect should be considered by TSV based wirelength calculation and TSV positioning. Experiments are carried out on 2D-3D transformation of IBM...
According to the International Technology Roadmap for Semiconductors (ITRS), the traditional scaling will no longer meet the performance and integration requirements of systems-on-chip (SoC) in the long term. Therefore, new I/O and packaging paradigms are needed. Three-dimensional integration is a promising alternative option to traditional 2D planar chips. 3D integration is mainly restricted by the...
A circuit-equivalent frequency-domain three-dimensional electromagnetic simulation for package structures is proposed. A robust and passive susceptance-element based model order reduction is applied to the governing equation for accelerated simulation and proof-of-concept is shown with the examples of power-ground structure simulations.
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