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External stress type whisker occurs in Sn plating surfaces by external stress. The whisker generated in connector causes short circuit issue. Although various measures are performed for inhibiting whisker, external whisker issue is not resolved completely at this time. In this paper, we found out that some doped tin alloys showed the whisker resistance corresponding to Sn-10Pb alloy. As a result of...
This work describes the improvement in reliability of a trench MOSFET through modification of the cobalt silicide module. Integration options explored are; (a) use of a nitride spacer, and (b) use of TiN cap during the salicidation process. WLR methodologies are used to quantify improvements that can then undergo more extensive PLR testing. The WLR methodologies used include highly accelerated wafer...
The mechanical and electrical properties of solder bumps influence the overall reliability of 3D ICs. A characteristic of solder bumps is that during technology processing and usage their material composition changes. This compositional transformation is enhanced by electromigration and leads to the formation of voids which can cause a complete failure of a solder bump. In this paper we present a...
A novel resistive memory with the TiN/Ti/HfOx/TiN stack is proposed and fully integrated with 0.18 μm CMOS technology. The excellent memory performances such as low operation current (down to 25 μA), low operation voltage (<;1.5 V), high ON/OFF resistance ratio (above 100), and fast switching speed (10 ns) have been demonstrated for this ReRAM. Moreover, the device exhibits excellent scalability...
The results of bonding and stress testing of Cu/Sn-Cu bonded dice and Cu-Cu thermocompression bonded dice at 10µm and 15µm pitch in large area arrays are shown. The interconnect bonding process pressure and temperature required for the formation of low resistance (<100 mΩ), high yielding (99.99% individual bond yield), and reliable interconnects is described. In the case of Cu/Sn-Cu, use of a mechanical...
Bias temperature instability of TiN/HfOx/Pt resistive random access memory (ReRAM) device is investigated in this work for the first time. As temperature increases (up to 100°C in this work), it is observed that: (1) leakage current at high resistance state (HRS) increases, which can be explained by the higher density of traps inside dielectrics (related to trap-assistant tunneling), leading to a...
Although a significant effort was made recently in the development of binary oxide based resistive memory (RRAM), reliability issue is still the most concern, but less addressed. By stressing the device in high resistance state (HRS) with constant voltage of the same bias polarity during SET process, the disturbed time is found to exhibit extreme low Weibull slope (~0.3). This characteristic can drastically...
A 30??30 nm2 HfOx resistance random access memory (RRAM) with excellent electrical performances is demonstrated for the scaling feasibility in this work. A 1 Kb one transistor and one resistor (1T1R) array with robust characteristics was also fabricated successfully. The device yield of the 1 Kb array is 100%, and the endurance for these devices can exceed 106 cycles by a pulse width of 40 ns. Two...
Two commonly used Pb-free solders, SnAg and SnCu, are studied for electromigration (EM) reliability. Two major EM failure mechanisms are identified in Sn-based Pb-free solders, which is mainly due to the differences in microstructures and Sn-grain orientation. In general, the EM damage in SnCu solder is driven by the fast interstitial diffusion of Ni and Cu away from solder/UBM interface and leads...
High density interconnection structures using an area-arrayed small bump structure have been employed in multi chip packages and modules. Both the diameter and the pitch of the bump will be decreased from a few hundred mum to dozens mum. Copper thin film interconnection and lead-free solder (mainly consists of tin) is used for the micro joint structures. As a result, the intermetallic compounds (IMC)...
Continuous scaling, necessary for enhanced performance and cost reduction, has pushed existing CMOS materials much closer to their intrinsic reliability limits, forcing reliability engineers to get a better understanding of circuit failure. This requires that designers will have to be very careful with phenomena such as high current densities or voltage overshoots. In addition to the reliability issues,...
Excellent bipolar resistive switching (RS) behavior was achieved in TiN/ZnO/Pt resistive random access memory (RRAM) devices. A unified physical model based on electrons hopping transport among oxygen vacancies along the conductive filaments (CFs) is proposed to elucidate the RS behavior in the RRAM devices. In the unified physical model, a new reset mechanism due to the depletion of electrons in...
ldquoDevelopment for advanced thermoelectric conversion systemsrdquo supported by the new energy and industrial technology development organization (NEDO) has been successfully completed as one of the Japanese national energy conservation projects. Three types of the cascaded thermoelectric modules operating up to 850 K in high electrode temperature and two types of Bi-Te thermoelectric modules operating...
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