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As electronic product becomes smaller and lighter with an increasing number of function, the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic systems. Silicon interposers with through silicon vias (TSV) and back end of line (BEOL) wiring offer compelling benefits for 2.5D and 3D system integration;...
This paper presents the modeling, design, fabrication and characterization, up to 30 GHz, of low loss and high aspect-ratio 55 μm diameter through package vias (TPVs) in 300 μm thick glass interposers. These TPVs were fabricated using a novel, high-throughput, focused electrical discharge method and low cost panel-based double-side metallization processes. Such a glass interposer is targeted at two...
Onsite determination of cell concentration in 3D cell culture construct is proposed based on electrical impedance measurement through on-chip vertical electrodes embedded in the 3D cell culture chamber. Cells were encapsulated in agarose gel and cultured in the 3D cell culture chamber. A pair of vertical electrodes was fabricated at the opposite sidewalls of the culture chamber for performing electrical...
An on-chip buck converter with 3D chip stacking is proposed and the operation is experimentally verified. The manufactured converter achieves a maximum power efficiency of 62% for an output current of 70mA with a switching frequency of 200MHz and a 2x2mm on-chip LC output filter in 0.35mum CMOS. The use of glass epoxy interposer to increase the maximum power efficiency up to 71.3%, and the power efficiency...
In this paper, the method of Spatial Fourier Transform has been used to investigate the pattern formation dynamics in a dielectric barrier discharge (DBD) system. With this method, patterns formed in the DBD system can be transformed into smooth frequency spectrum. The frequency constitution of discharge pattern can be analyzed. In our experiment mixed gas of 96% Ar and 4% air at 0.9 atm is used as...
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