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As the feature size of integrated circuits shrinking in deep submicron technologies, time delay, and crosstalk noise of complementary metal-oxide-semiconductor (CMOS)-gate-driven interconnects become critical issues. Traditionally, CMOS driver is simplified as a linear circuit in which a constant resistance is used to approximate the nonlinear and time-varying MOS resistance, which is inaccurate for...
Partially Depleted (PD) SOI CMOS has become increasingly popular due to its performance advantages over bulk CMOS. However signal integrity analysis of SOI designs continues to be a challenging task. One of the major problems is accurate prediction of circuit behavior due to history effect associated with SOI MOS devices. Prior switching effects floating body voltage, which in turn has impact on MOS...
Accurate extraction of parasitics is an important pre-cursor to timing and signal integrity analysis. In deep sub-micron technologies, the interconnect cross-section areas of metal at various points in a layer are no longer the same -the metal can be etched differently with varying width and spacings and/or the top-surface of the interconnect layer may be non-planar due to chemical mechanical polishing...
Wire bond ball grid array technology is widely used in the Intelreg South Bridge, or I/O controller hub (ICH) for a few generations. With the continuing scaling speed of the I/O interfaces, ICH has SATA Gen 2 links and PCI express links operating at 2.5 Gbits/s and 3 Gbits/s respectively within one chip. Due to the heavy traffic and new features, it pushes the electrical performance of wire bond ball...
Increased frequencies and reduced rise times have made signal integrity simulations an integral part of high speed board designs. Signal integrity simulations are usually performed considering an ideal power source and power integrity simulations are performed assuming ideal transmission lines. But due to ever decreasing rise times errors creep into signal quality and timing analysis by ignoring the...
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