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A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-board would...
Direct attach of lasers and photodiodes on boards with optical interconnects can facilitate high-density packaging of high-speed optical components. For the technology demonstration, test chips are assembled by means of optical polymer pillars on substrates with embedded arrays of waveguides (WGs) and 45deg mirrors. The light couples vertically though the optical pillars enabling 1.5-dB reduction...
Non-Conductive Films (NCFs) have become one of the promising interconnection adhesives for flip-chip assembly. Because NCFs have many advantages such as low cost, easy handling, and fine pitch application. However, effects of the material properties of NCFs on the reliability of NCFs flip- chip assemblies have not been fully understood. In this paper, effects of multi-functional epoxy and the addition...
The shadow moire technique is a widely used method of measuring printed wiring board (PWB) warpage. It has a high resolution, high accuracy and is suitable for use in an online environment. The shortcoming of the shadow moire technique is that it cannot be used to measure PWBs populated with chip packages. In this paper, a warpage measurement system based on the projection moire technique is presented...
Stress sensing test chips are used to investigate die stresses arising from assembly and packaging operations. The chips incorporate resistor or transistor sensing elements that are able to measure stresses via the observation of the changes in their resistivity/mobility. The piezoresistive behavior of such sensors is characterized by three piezoresistive (pi) coefficients, which are electro-mechanical...
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