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Thermal runaway is among the major failure mechanisms of power semiconductor packages. Thermal dissipation of power electronics depends on the quality of the solder die-attach, any defects such as voids, and delamination-impede heat dissipation that results in hot spots that can cause thermal runaway and/or a premature device failure. Therefore, investigation of thermal impact due to die-attach defects...
QFN packages gained popularity among the industry due to its low cost, compact size, and excellent thermal electrical performance. Although PCBs are widely used for QFN packages in handheld devices, some customers require it for heavy industrial application demanding thicker PCB. When an electronic device is turned off and then turned on multiple times, it creates a loading condition called power...
For power module, the reliability evaluation of thermal fatigue life by power cycling has been prioritized as an important concern. Since in power cycling produces there exists non-uniform temperature distribution in the power module, coupled thermal-structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a Si chip and a substrate causes thermal...
For power electronics devices, the reliability of thermal fatigue induced by power cycling has been prioritized as an important concern. Since power cycling produces non-uniform temperature distribution in the device, coupled thermal- structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a package and a substrate causes thermal fatigue. Many...
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