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The temperature-current rise in modern (up to 100–150 microns wide) PCB traces is simulated using three software tools ANSYS, HyperLynxThermal and ELCUT. The results are compared with the IR measurements in PCB copper traces with different sizes and substrate materials. It is shown that ANSYS correctly describes the thermal behavior for all tests, other tools have some limitations for small size traces.
A new “heatsink-less” LED based T8 retrofit design is proposed in this study. The lamp consisted of light emitting elements directly attached on a flexible substrate. The substrate is mount on to the inner wall of a full cylindrical glass tube. The design is intended to simplify the lamp construction. However, since the metal-based heat sink is eliminated, the thermal design is a concern. Finite element...
With the growing of the applications of surface acoustic wave (SAW) devices, the requirement for the accuracy of the operating frequency of the SAW devices is constantly strengthened. The impact of thermal strain on the characteristics of SAW devices cannot be ignored, which induced in their packaging process. In this paper, by using the finite element method (FEM) software, the thermal strain induced...
Since 3D-TSV technology has been more and more popular aiming at the demand of lightweight and multi-functions of electronic devices in recent years, the μ-C4 bumps with smaller size which interconnect the stacked die will suffer more serious operating stress, and even one of the thousands bumps fails, the device will fail. Hence, it is meaningful to study the reliability of smaller size and higher...
DC/DC converters are widely used in industrial, aerospace and other fields. The reliability of DC/DC converters is very important for the whole electronic system. Overheat is the key factor infecting the reliability of DC/DC converters because of the power density of the device. Three-dimensional thermal analysis modules include heat distribution analysis and thermal stress analysis at 25 °C in this...
An experiment is conducted to study failure mechanism during flip chip attach process for Cu Pillar bumped Si device that uses mass reflow assembly technology. A three-leg design of experiment (DOE) is conducted, which includes two UBM sizes, two different Cu pillar height, and with / without polyimide option to collect basic failure information. Finite element software is used to correlate the failure...
The trends towards miniaturization in the electronics industry coupled with advances in flip chip technology have increased the use of flip chip on board or direct chip attach technology in many products. This is especially true for products where re-work is not an option. Reliability issues were overcome by the use of underfill to couple the chip to the substrate and subsequently significant advances...
We present a numerical method to extract specific contact resistivity (SCR) for three-dimensional (3-D) contact structures using a two-electrode test structure. This method was developed using Finite Element Modeling (FEM). Experimental measurements were performed for contacts of 200 nm nickel (Ni) to p+-type germanium (Ge) substrates. The SCR obtained was (2.3–27) ×10−6 Ω·cm2
A new “heatsink-less” LED based T8 retrofit design is proposed in this study. The lamp consisted of light emitting elements directly attached on a flexible substrate. The substrate is mount on to the inner wall of a full cylindrical glass tube. The design is intended to simplify the lamp construction. However, since the metal-based heat sink is eliminated, the thermal design is a concern. Finite element...
Since 3D-TSV technology has been more and more popular aiming at the demand of lightweight and multi-functions of electronic devices in recent years, the μ-C4 bumps with smaller size which interconnect the stacked die will suffer more serious operating stress, and even one of the thousands bumps fails, the device will fail. Hence, it is meaningful to study the reliability of smaller size and higher...
With the growing of the applications of surface acoustic wave (SAW) devices, the requirement for the accuracy of the operating frequency of the SAW devices is constantly strengthened. The impact of thermal strain on the characteristics of SAW devices cannot be ignored, which induced in their packaging process. In this paper, by using the finite element method (FEM) software, the thermal strain induced...
Parallel surface contact between the template and the substrate is very important in imprint lithography. In this paper, a novel force-decoupled compound parallel alignment stage is proposed for high-resolution imprint lithography. It mainly consists of a high-stiffness spherical air bearing (SAB) and a multi-degree-of-freedom (multi-DOF) flexure-based mechanism that functions for both the active...
This research focuses on the design and fabrication of a MEMS-based pressure sensor to measure the internal pressure of a thermal management system for fuel cell electric vehicles. The principle of measurement of the pressure is converting the piezoresistor value on a diaphragm deformed by a pressure difference into an output voltage. The diaphragm should operate normally for pressure sensing even...
This paper presents innovations and advances in demonstrating paper-thin organic packages with low warpage. These advances include: 1) Reduction in over-all substrate warpage, 2) Ultra-low stand off interconnection height, 3) Ultra-thin (30 μm core thickness) and ultra-low CTE (1–5 ppm/°C) organic substrates, 4) Assembly of large die onto the ultra-thin substrate, and 5) Assembly to form advanced...
This paper demonstrates, for the first time, a Wireless Local Area Network (WLAN) radio frequency (RF) front end module (FEM), incorporating the smallest, high-performance band-pass filter (BPF) on a 110μm-thin organic substrate with chip-last embedded actives and thin-film passives. The FEM consists of a power amplifier (PA) die, a switch die, and two low-noise amplifier (LNA) dies, integrated with...
In this paper, lossy metasurfaces are employed in the design of uncooled terahertz (THz) bolometers on polymer substrate. The metasurface bolometer is composed of a metal backed low loss dielectric substrate and thin patterned lossy metal layer. Numerical simulations using finite element method (FEM) are carried out to design optimal unit cells with high absorptivity. An array of these unit cells...
With the increasing demand for reduced package size and enhanced package performance, the semiconductor industry has intensified focus on the development of alternate technologies, resulting in significant interest in flip chip or direct chip attach (DCA) packages using copper pillar bump interconnects. In DCA packages, the coefficient of thermal expansion (CTE) mismatch between different materials...
Semiconductor industry has recognized the need to replace traditional Al/SiO2 interconnects with Cu/Low-k interconnects in the mainstream electronics devices following the latter's impact on power, RC delay, and cross-talk reduction. However due to lower elastic modulus, strength, and poor adhesion characteristic, reliability of the Cu/Low-k interconnects turns out to be a concern for its integration...
Various modifications of the ZnO nanostructures based sensitive element for the two-port surface acoustic wave sensor (SAW) design were considered. The influence of morphometric parameters (diameter and length) of ZnO nanostructures on output SAW sensor characteristics was investigated by finite element simulation method. Obtained versatile flexible multiparameter model allowed the evaluation of performance...
This paper presents the dispersion characteristic of a substrate integrated waveguide (SIW) of parallel metallic plates. The hybrid generalized scattering matrix and finite-element method (GSM/FEM) method accurately depicting the fields inside the rectangular waveguide section, transitions, and external parallel-plate region. The presented method establishes a rigorous approach to tackle the periodic...
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