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In this paper we propose thermal aware global routing of interconnects which reduces the probability of failure of chips due to interconnect failures. Temperature has a very serious effect on the mean time to failure (MTF) of interconnects because of electromigration. We present TAGORE, a thermal aware global router. TAGORE achieves a reduction in the probability of failure by routing more wires in...
The electromigration performance of the 1.2-μm-diameter via chain between two levels of an Al line was evaluated. It was found that the electromigration lifetime of the vias decreases owing to the increase in the total compressive stress in the passivation layer, even though the step coverage of Al film in the vias is improved by controlling the slope angle of the via hole to increase the electromigration...
It is argued that the substantial reduction in hillock formation with F (fluorine) incorporation (relative to Cu incorporation) is predominantly due to the reactive nature of the F. The highly electronegative fluorine forms a much stronger chemical bond than aluminum with itself or aluminum with Cu, which acquires its beneficial effects from forming Cu precipitates at grain boundaries. Due to the...
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