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Data centers (DCs) contribute toward the prevalent application and adoption of the cloud by providing architectural and operational foundation. To perform sustainable computation and storage, a DC is equipped with tens of thousands of servers, if not more. It is worth noting that the operational cost of a DC is being dominated by the cost spent on energy consumption. In this paper, we model a DC as...
Evaluating the accuracy of the PVsyst thermal model for large scale free-field thin film photovoltaic installations (> 1MW) using measured module temperatures from 4 PV systems reveals that the default thermal parameters within PVsyst over-estimate the cell temperature of the First Solar Cadmium Telluride thin film modules by 3–5 degrees Celsius. This results in a slight conservatism in the energy...
In a scenario of small and customized production of electric vehicle, it is important to set methods and tools to evaluate the Li-Ion cells heat source in EV battery. The main problem of the new lithium batteries is represented by the need to keep the battery packs at uniform and constant temperatures and avoid peaks of temperatures which cause degradation of performance and safety problem. The main...
This paper presents an investigation into the thermal behavior of a DC-DC converter integrated on the back side of a thin-film photovoltaic (PV) module. Analytical thermal models of the converter and the PV module are made and the results obtained from the models are compared to the results obtained by computational fluid dynamics (CFD) simulations.
This paper shows a practical approach to GaN-based HEMT self-consistent electro-thermal simulation for circuit modeling and reliability estimation. A physical-level lumped element dynamic thermal network able to describe the two-dimensional device geometry is self-consistently coupled with an electro-thermal compact large-signal model. The results obtained with the lumped-element thermal network are...
We have developed and employed an automated multi-scale modeling approach to investigate thermal issues in analog integrated circuits (ICs) and to enable ldquothermally awarerdquo design thereof. Thermal analysis from full-chip scale down to the single transistor level was made possible with this approach utilizing the finite volume three-dimensional (3D) numerical technique. We have developed new...
A multi-scale modeling approach is proposed and employed to investigate thermal issues and to enable "thermally aware" design of radio-frequency (RF) integrated circuits (ICs). Thermal analysis from full-chip scale down to the single transistor level was made possible with the development of this approach using the finite volume three-dimensional (3D) numerical technique. We have developed...
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