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In this paper we propose thermal aware global routing of interconnects which reduces the probability of failure of chips due to interconnect failures. Temperature has a very serious effect on the mean time to failure (MTF) of interconnects because of electromigration. We present TAGORE, a thermal aware global router. TAGORE achieves a reduction in the probability of failure by routing more wires in...
Recently design for manufacturability (DFM) has been required to achieve higher process yield. Information obtained from silicon by testing and/or fault analysis is sometimes fed back for redesign of VLSI circuits. In this paper we propose a method to maximize defect coverage of a test set initially generated for stuck-at faults in a full scan sequential circuit by using feed back information from...
Modern hybrid wafer scale integration (HWSI) devices increasingly employ flip-chip bonding. Thermal cycling tests do not model the true operating conditions of HWSI devices, as the differences in operating temperatures of chips and substrate are neglected. These temperature differences resemble the most important thermal bond failure mechanism. An approach to the modeling of true operating conditions...
It is shown that for typical values of test coverage and yield, increasing the test coverage will have a greater impact on quality for a lower cost than similar increases in yield. This relationship often holds even when the increase in yield is much larger than the increase in test coverage. It must be ensured that the test coverage is based on fault models that accurately describe the behavior of...
The electromigration performance of the 1.2-μm-diameter via chain between two levels of an Al line was evaluated. It was found that the electromigration lifetime of the vias decreases owing to the increase in the total compressive stress in the passivation layer, even though the step coverage of Al film in the vias is improved by controlling the slope angle of the via hole to increase the electromigration...
It is argued that the substantial reduction in hillock formation with F (fluorine) incorporation (relative to Cu incorporation) is predominantly due to the reactive nature of the F. The highly electronegative fluorine forms a much stronger chemical bond than aluminum with itself or aluminum with Cu, which acquires its beneficial effects from forming Cu precipitates at grain boundaries. Due to the...
A description is given of an expert system that helps diagnose failures on VLSI memories. The expert system is intended to be used in the fields of quality assurance and failure analysis. After a discussion of the problem and the definition of the project, the different databases used and the architecture of the expert system are described. Then, the strategy of the system, which depends on the kind...
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