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As the electronic packaging density continues to increase, flip chip or stacked packaging via bump bonding is gradually replacing traditional wire bonding and will become the mainstream packaging form in the future. For copper bumps, this new type of electronic interconnection has not yet been fixed by industry standards. Therefore, this paper has made a preliminary study on the reliability of this...
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to...
This research focuses on the formation and growth behavior of Cu/Al intermetallic compounds (IMCs). In order to investigate IMC growth after 30, 60 and 120 min of aging at 270, 300 and 330 °C, cross-section of Al, Cu and Cu/Al IMCs were examined by scanning electron microscopy (SEM). The results showed that the consumption of the Al layer is more rapid than that of Cu layer, and that after 120 min...
Field deployed electronics us often subjected to a combination of thermal aging and thermal cycling. The thermal cycle magnitudes may vary over the lifetime of the product. Long-life systems may be re-deployed several times over the use life of the product. Aging has been previously shown to effect the reliability and constitutive behaviour of second-level leadfree interconnects. Often the equipment...
Electronic systems are often stored for long periods prior to deployment in the intended environment. Aging has been previously shown to effect the reliability and constitutive behavior of second-level leadfree interconnects. Deployed systems may be subjected to cyclic thermo-mechanical loads subsequent to deployment. Prognostication of accrued damage and assessment of residual life is extremely critical...
Gold and copper ball bonds were isothermally aged under moist conditions (85°C and 85% relative humidity (RH)) and wet conditions (85°C in DI water with and without NaCl) in an effort to better understand the corrosion mechanisms that operate under moist and wet conditions. The objective of this work is to undertake and report on the initial stages of a research project that aims to compare the performance...
Copper and gold ball bonds were bonded on 1.2 μm thick Al-0.5%Cu-1%Si. One set of devices was aged at 175°C up to 1000 hours. A second set of devices was pre-conditioned for 168 hours at 85°C and 85% relative humidity followed by ageing at 175°C up to 1000 hours. No cratering was found with either wire in as-bonded devices but devices bonded with copper developed cratering after ageing. Neck and stitch...
Copper (Cu) wire bonding is getting more common as interconnections on aluminium (Al) bond pad metallization in microelectronics due to lower cost compared to gold wire bonding. The Cu-Al intermetallic compounds (IMC) growth in Cu ball bonds has been investigated by many researches but the understanding of the IMC phases is still incomplete and the impact to bond reliability know-how is limited. This...
Due to increasing cost of gold and technological demand for finer pitch application, Au bonding wires with finer diameter are needed. In such demands, Au bonding wire manufacturing companies produced ultra-fine Au wires with diameter of 12 μm (0.5 mil). However, interfacial reactions between ultra-fine Au wires and Al pads may cause serious reliability problems as wire diameter get smaller. Decrease...
Electronic systems are often stored for long periods prior to deployment in the intended environment. Aging has been previously shown to effect the reliability and constitutive behavior of second-level leadfree interconnects. Deployed systems may be subjected to cyclic thermo-mechanical loads subsequent to deployment. Prognostication of accrued damage and assessment of residual life is extremely critical...
In summary, 2N wire is able to improve thermal aging performance of ultra fine pitch wire bonding to meet reliability requirement as stringent as for automotive application. However, to improve mass production friendliness, careful characterization and process optimization need to be done on several areas, namely bonding surface condition, wire bonding process, as well as wire manufacturing process.
The formation and growth of intermetallic compound layer thickness is one of the important issues in search for reliable electronic and electrical connections. Intermetallic compounds (IMCs) are an essential part of solder joints. At low levels, they have a strengthening effect on the joint; but at higher levels, they tend to make solder joints more brittle. If the solder joint is subjected to long-standing...
This paper deals with presentation of some new aspects of solder ternary alloy 96.5Sn3Ag0.5Cu (wt.%) - SAC305, in order to determine variations in mechanical properties and microstructure caused by treatment in vapour phase soldering (VPS) as well as by accelerated isothermal aging. These specimens have been melted and solidified on HASL (hot air solder levelling) and Ni/Au (ENIG) PCB (printed circuit...
The morphological features and growth kinetics of interfacial IMCs have shown significant effect on the mechanical properties, and hence, on the reliability of lead free solder joints. The growth behavior of the interfacial IMCs of SnAgCu/Cu solder joint, in reflow and thermal cycling, was investigated with the focus on the influence of reflow dwell time and the cyclic parameters on the growth kinetics...
Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles...
The reliability of lead free electronic devices depends strongly on the reliability of the soldered joints while the later one was controlled, mainly, by the formation and growth of the interfacial intermetallic compounds (IMCs) between the solder matrix and the substrates. The morphological features, microstructural evolutions and growth kinetics of the IMCs on the interfacial of SnAgCu/Cu soldered...
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