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This study describes board-level drop reliability of TFBGA subjected to JEDEC drop test condition which features an impact pulse profile with a peak acceleration of 1500G and a pulse duration of 0.5 ms. The solder ball is assumed as an elastoplastic model, and the other components are assumed to be linear elastic models. Both the global/local finite element method and the finite grid region method...
Electronic assemblies in field use are exposed to a wide range of environmental loads. The interaction of combined loads has to be considered in lifetime estimates of electronic packages. In this paper, we discuss lifetime prediction for lead-free soldered flip chips under vibration load in different temperature environments in terms of solder joint fatigue. Parameters for lifetime modeling are obtained...
In this paper, four-point cyclic bend test was conducted for PBGA (plastic ball grid array) assembly with Sn-3.5Ag lead free solder joint. Bending fatigue life of solder joint was recorded by measuring resistance of the designed daisy-chain for solder joints. Failure analysis was performed using dye penetration and the critical solder joint location was observed. Then, comprehensive finite element...
Reliability performance during drop impact is critical for electronic handheld devices. In this paper, a comprehensive study in efficiency and accuracy of multiple finite element modeling approaches and solution techniques for a wafer-level package (WLP) is presented. JEDEC specified test board is used for the model study. A direct acceleration input method is introduced. Two types of global finite...
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