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In this work, a simple electric circuit model for the evaluation of the impact of vias (inter-metallic vertical connections) in resonant rotary traveling wave oscillator (RTWO) is proposed. A test structure was designed to quantify the degradation on the signal integrity of RTWOs caused by these vias. The test structure and the RTWO were designed according to the rules of the 130 nm commercial mixed...
In this paper a fast parasitic-aware synthesis approach of CMOS analog circuit is presented. Instead of the conventional approach of circuit sizing followed by layout generation, extraction and verification, we propose a method that considers the performance constraints and layout induced parasitics simultaneously within a concurrent phase of circuit synthesis. The proposed methodology is tested with...
This paper discusses the importance of chip-level EM-simulations required at millimetre wave frequencies for achieving correct results. The negative impact of interconnects on passive structures and the inability of the conventional RC-extraction to cater their effects necessitate alternative solutions. Furthermore during IC-measurements the number of probing points is limited; therefore chip-level...
Achieving power- and area-efficient fully integrated transceivers is one of the major challenges faced when designing high-frequency electronic circuits suitable for biomedical applications or wireless sensor networks. The power losses associated with the parasitics of on-chip inductors, transistors, and interconnections have posed design challenges in the full integration of power-efficient CMOS...
The challenges of deriving early-adopter competitive advantage, even with fabless access to process technology, through leveraging features offered by the advanced, and possibly disruptive, process technologies in real SoC products, are outlined. A structured methodology for addressing these challenges, and bridging the gap between process and design, sufficiently early in the development cycle to...
This paper describes a design flow for the circuit-level optimization of a technology. The concurrent exploration of device characteristics and library design choices leads to a more application-optimal technology. We illustrate the design flow by: 1) analyzing the impact of buffer cell design, and 2) by optimizing a 130 nm technology for low operational power.
The power consumption and the matching will be the principal issues at the 32 nm node and below. In this context, Ultra-Thin Body devices are extensively studied for the end-of-roadmap CMOS. In this paper we present the SON technology, leading to the simple fabrication of sustained mono-Si nano-membranes over an empty tunnel, and discuss on the application of this process to build-up electronic devices...
Novel 3D stacked gate-all-around multichannel CMOS architectures were developed to propose low leakage solutions and new design opportunities for sub-32 nm nodes. Those architectures offer specific advantages compared to other planar or non planar CMOS devices. In particular, ultra-low IOFF (< 20 pA/mum) and high ION (> 2.2 mA/mum) were demonstrated. Moreover, those transistors do not suffer...
In deep submicron era, to prevent larger amount of SRAM from more frequently encountered overheating problems and react accordingly for each possible hotspots, multiple ideal run-time temperature sensors must be closely located and response rapidly to secure system reliability while maintaining core frequency. This paper presented a method to extract run-time temperature information from multiple...
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