Serwis Infona wykorzystuje pliki cookies (ciasteczka). Są to wartości tekstowe, zapamiętywane przez przeglądarkę na urządzeniu użytkownika. Nasz serwis ma dostęp do tych wartości oraz wykorzystuje je do zapamiętania danych dotyczących użytkownika, takich jak np. ustawienia (typu widok ekranu, wybór języka interfejsu), zapamiętanie zalogowania. Korzystanie z serwisu Infona oznacza zgodę na zapis informacji i ich wykorzystanie dla celów korzytania z serwisu. Więcej informacji można znaleźć w Polityce prywatności oraz Regulaminie serwisu. Zamknięcie tego okienka potwierdza zapoznanie się z informacją o plikach cookies, akceptację polityki prywatności i regulaminu oraz sposobu wykorzystywania plików cookies w serwisie. Możesz zmienić ustawienia obsługi cookies w swojej przeglądarce.
A novel method for the evaluation of thermal conductivity of paste materials is proposed in this paper. The principle is based on the measurement of the thermal conductivity of composite materials together with finite element modeling (FEM). In the present study, the FEM based on the structure and working principle of an apparatus (THISYS) used for measuring the thermal conductivity of thin and solid...
All market segments continue to put cost pressure on semiconductor and packaging suppliers in order to stay competitive. Taking advantage of continuing silicon innovation in fabrication process, silicon area reduction and more device functionalities increase potential die count per wafer and lower the die cost. Staying in wire bond packaging instead of migrating to flip chip packaging further provides...
Two modeling techniques are employed to study two automation goals for a manufacturing process; automation of the design of custom-engineered dies and automation of the manufacturing process that uses them. In both cases the objective is to improve energy efficiency and throughput of a manufacturing process known as “Hotsizing”. Finite Element Modeling (FEM) is used to study the surface temperature...
A methodology for the design of commercial-scale sources for the evaporation of Cu, Ga, and In is described. Semi-empirical flow equations are utilized in predicting the internal pressure profile, and compared against temperature profiles generated by finite element modeling. This approach allows for the prediction of condensation within the source, and subsequent droplet ejection towards the substrate...
This paper presents the use of an array of piezoceramic microheaters embedded in a biopsy needle for tract cauterization. Circular PZT-5A heaters of 200 ??m diameter and 70-80 ??m thickness are embedded in the wall of a 20-gauge stainless steel needle. Finite element modeling suggests that a PZT array with no gap between the elements to be the most suitable design. The temperature profile generated...
This paper presents a finite element modeling technique for double U-tube borehole heat exchangers (BHE) and the surrounding soil mass. Focus is placed on presenting numerical analyses describing the capability of a BHE model, previously introduced by the author, to simulate three dimensional heat transfer processes in multiple borehole heat exchangers embedded in multi layer soil mass, in a computationally...
Thermal simulation of a stack consists of three IC layers bonded ??face up?? is performed using finite element modeling. Significant reduction of ~62??C in maximum chip temperature is predicted by inserting an electrically isolated thermal through silicon via (TTSV) having Cu core and oxide liner shell that extends across IC layers to the substrate. The effects of TTSV dimensions and its extension...
A confined-chalcogenide phase-change memory (CC) with thin metal oxide interlayer (TMOI) aimed to lowering the reset current is proposed in this paper. This proposed structure offer a reduction of the reset current by 65%, 50% and 34.38% in comparison with a normal-bottom-contact (NBC) cell, CC cell and NBC with TMOI cell, respectively. The electrical and thermal characteristics were investigated...
Ultrasound hyperthermia has become one of the new therapeutic modalities for breast cancer treatment, since ultrasound appears to selectively affect malignant cells without causing any deleterious effects to the surrounding normal tissues. The main objective of this study is to numerically simulate the interaction of therapeutic ultrasound with a multi-tissue type system, and to develop an analytical...
This paper reports the design, modeling, fabrication and measurement of a CMOS-compatible surface-micromachined test structure for the determination of the thermal conductivity of thin films based on the Seebeck effect. The Seebeck effect-based temperature sensing is more advantageous for thin film materials with a relatively large Seebeck coefficient, such as lightly doped poly-Si and poly-SiGe....
Podaj zakres dat dla filtrowania wyświetlonych wyników. Możesz podać datę początkową, końcową lub obie daty. Daty możesz wpisać ręcznie lub wybrać za pomocą kalendarza.