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IEEE Transactions on Applied Superconductivity > 2018 > 28 > 3 > 1 - 5
IEEE Electron Device Letters > 2018 > 39 > 1 > 55 - 58
IEEE Transactions on Magnetics > 2018 > 54 > 1 > 1 - 4
Journal of Microelectromechanical Systems > 2017 > 26 > 6 > 1381 - 1388
IEEE Transactions on Magnetics > 2017 > 53 > 12 > 1 - 6
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 11 > 1765 - 1773
IEEE Transactions on Magnetics > 2017 > 53 > 11 > 1 - 4
IEEE Transactions on Magnetics > 2017 > 53 > 11 > 1 - 5
IEEE Transactions on Magnetics > 2017 > 53 > 11 > 1 - 7
IEEE Transactions on Magnetics > 2017 > 53 > 11 > 1 - 4
IEEE Transactions on Magnetics > 2017 > 53 > 11 > 1 - 4
IEEE Instrumentation & Measurement Magazine > 2017 > 20 > 5 > 27 - 29
IEEE Microwave and Wireless Components Letters > 2017 > 27 > 10 > 939 - 941
IEEE Electron Device Letters > 2017 > 38 > 10 > 1394 - 1397
IEEE Transactions on Electron Devices > 2017 > 64 > 8 > 3219 - 3225
IEEE Transactions on Semiconductor Manufacturing > 2017 > 30 > 3 > 227 - 235
IEEE Electron Device Letters > 2017 > 38 > 7 > 949 - 951
IEEE Sensors Journal > 2017 > 17 > 13 > 4107 - 4114
IEEE Transactions on Instrumentation and Measurement > 2017 > 66 > 6 > 1482 - 1488
IEEE Transactions on Electron Devices > 2017 > 64 > 6 > 2655 - 2658