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3-Dimentional (3D) X-ray imaging significantly increases the visibility of the bond wires and lead frame structures of the complicated integrated circuits (IC) packages, particularly for the less visible Copper (Cu) bond wires used in more recent IC devices. It has become a very useful and effective technique for detecting package related failures without going through the lengthy physical analysis...
Carbon particle is not able to be detected by X-ray, so it is always a challenge to find out the defect mode if caused by conductive carbon particle in package. A non-destructive, quick and precious fault localization method with lock-in thermography (LIT) was demonstrated and follow up physical analysis (PFA) was performed. Consequently, conductive carbon particle was confirmed as the root cause...
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