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A back-side grinding CMOS-MEMS process is well established for thinning wafers down to tens of micrometres for use in stacking chips. As a result of the mechanical process, the wafer backside is compressively stressed. In this paper, authors investigate the influence of the backside induced stress in MEMS/CMOS wafers thinned down to 35∼275 μm by means of a micro-Raman technique. We found that the...
This paper demonstrates integration non-destructive analysis tools solution of MEMS multi-bonding to inspect the fusion bonding interface and eutectic bonding interface to locate defect layers. This analytical study shows successful SAT (Scanning Acoustic Tomography) and IROM (Infrared Optical microscopy) inspection of MEMS multi-bonding single issue layer. The multi-bonding double layers were happened...
As the applications of micro electronic mechanical system (MEMS) are booming, more and more research and development activities are involved in the MEMS industry. For every new MEMS product with new functions, the manufacturing process will be tailored to cope with the changes. This requires reliability work to ensure the robustness of the new process. Thus, failure analysis plays an important role...
Anti-stiction coatings are frequently deposited onto MEMS surfaces to prevent moving structures from getting stuck. Therefore, in order to resolve stiction issues during MEMS production, it is important to characterize the anti-stiction coating effectively. Time-of-Flight SIMS was found to be very useful to this purpose, where the C2F4 signal from the perfluoro-decyltrichlorosilane (FDTS) anti-stiction...
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