The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The last decade has seen an explosion in research efforts which attempt to miniaturize rack-mounted, neural interface electronics to a form that is easily implantable for in vivo applications. Commensurate with this trend, neural scientist and engineers are demanding higher performance electronics for neural stimulation, recording, encoding, communication and energy harvesting, all in the context...
The term “the Internet of Things” was first used in 1999 to refer to a network of objects embedded with sensors and wireless connectivity. By 2015, there were 5 billion of these connected devices. Within the next five years, it is predicted that there will be more than 25 billion connected IoT devices. This rapid market growth has been made possible by many innovations in connectivity standards, system...
The continuing progress and integration levels in silicon technologies make complete end-user systems on a single chip possible. This massive level of integration makes modern manycore chips all pervasive in domains ranging from weather forecasting, astronomical data analysis, and biological applications to consumer electronics and smart phones. Network-on-Chips (NoCs) have emerged as communication...
In this tutorial evolution of transistors from planar technology will be discussed. Scaling limitations of conventional transistors that led to development of Finfet (or 3D) transistors will be presented in detail. Circuit Design challenges associated with 3D transistors will be analysed in this tutorial. Lastly, a brief overview of future transistor architectures beyond Finfet's will be provided.
Rumors of Moore's Law demise have been greatly exaggerated! While transistors are not getting simultaneously smaller, faster and lower power every couple of years like for the past several decades, inexorable forces to cram more devices together are still running strong, except that they are now pushing upwards in the third dimension. Heterogeneity, monolithic vs. TSV-based scaling for 3D, and closing...
The Internet of Things is creeping into ever more critical areas of our lives. From drug pumps to aircraft, connected cars and even smart weapons - there are few products coming off the production line today which don't have an added element of ‘intelligence’ and connectivity. There's just one problem: they are fundamentally flawed. And in this brave new world, that could result not just in data theft...
It is our pleasure to warmly welcome you to the 29th IEEE International System-on-Chip Conference. The 2016 edition of the SoC conference is hosted in the beautiful city of Seattle, WA (USA). The Seattle area is a hot-bed of technology research and development with companies such as Amazon, Boeing, and Microsoft as well as universities like the University of Washington calling it home. With such a...
If everybody tells the same story, then it's time to start new adventures! For a short time let the ARMy of boring “me-too” behind and discover a new realm of possibilities in the melting pot of digital and analog circuits. Experience a new form of “Inherent Artificial Intelligence”, self-powered contactless “Smart-by-Nature” sensing circuits (beyond RFID & NFC), as well as new ideas for MEMS...
According to the World Health Organization's 2008 report, the top three leading causes of death worldwide are coronary heart disease, cerebrovascular diseases, and lower respiratory infections. Governments and biomedical companies are pouring millions of dollars into research and development to find solutions for these diseases, and technological platforms to support disease management. Wireless biosensors...
The most significant challenge for continued integration of complex systems is energy efficiency. 3D heterogeneous stacking of diverse circuit blocks is one of the most promising solutions. The tutorial will focus on three-dimensional integrated circuits (3D ICs) consisting of multiple layers of systems integrated vertically using through silicon vias (TSVs). We will discuss advantages and challenges...
This talk presents some of the prominent barriers to designing energy-efficient circuits in the sub-14nm CMOS technology regime and outlines new paradigm shifts necessary in next-generation multi-core microprocessors and systems-on-chip. Emerging trends and key challenges in sub-14nm design are outlined, including (i) device and on-chip interconnect technology projections, (ii) performance, leakage...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.