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Major global challenges of the 21st century are drivers for the industry and especially for the semiconductor industry. Microelectronics and semiconductors are key enabling technologies and will contribute significantly to increasing Innovation and Productivity. Infineon provides semiconductors and system solutions, focusing on three central needs of modern society: Energy Efficiency, Mobility and...
Modern high-speed silicon technologies in the submicron region enable today very efficient and cost effective digital communication systems. Highly integrated system-on-chip (SoC) solutions cover satisfying the ever-increasing demand for broadband communication from home. High data transfer rates with excellent quality are achieved through the use of Wi-Fi, DSL, Ethernet and optical transport. The...
Contemporary development projects of ASICs for sensor-nodes in automotive and consumer industry are facing a variety of challenges due to strong requirements for robustness, performance and flexibility for automotive applications and strong requirements about power consumption and die-size for consumer applications. The ASIC development divisions of the Robert Bosch GmbH are facing these challenges...
Digital polar transmitter concepts based on RF-DA-converter recently proved the potential to significantly reduce power consumption. Furthermore, external component count as well as PCB area is minimized since no TX SAW filter is required and a single multimode, multiband power amplifier can be used.
The most recent series of Xilinx FPGAs in 28nm host a wide range of the most advanced technologies. 3D-IC technology has allowed for a doubling of logic capacity in a single device, commensurate with going to the next process node, with the added advantages of reduced power and improved yield. New levels of programmable systems integration are enabled through the cointegration of digital FPGA die...
Due to their superior mechanical properties and the cost advantage associated with their processing, organic thin-film transistors can be viewed as an important technology for a broad range of applications spanning from optical displays, microelectronics to optical, chemical, and biological sensors. There is no doubt that, as the technology matures the number of applications will keep increasing with...
This paper demonstrates the design of a high power, high efficiency inverter based on SiC (Silicon Carbide) JFET (Junction Field Effect Transistor) switches. It starts with a problem statement, i.e. which requirements are to be fulfilled, discusses design solutions, and ends with some measurements of the complete system. The final design is able to handle more than 1000V, currents of more than 30A...
Shrinking feature sizes in IC manufacturing are required for implementing Moore's law of doubling device density. Higher device density enables increasing digital IC performance. For mixed-signal ICs, shrinking transistor size implies increasing variability of analog device parameters. This has prevented analog circuit designs to benefit from shrinking process geometries. At the same time, increasing...
We present a CMOS 8-channel frequency division multiplexer (FDM) to interface a phased array of micro coils for 9.4 T (400 MHz Larmor precession frequency ω0) for magnetic resonance imaging (MRI). The integrated multiplexer contributes towards a solution to achieve phased arrays with a massive number of coils without unnecessarily increasing system complexity, the size of hardware, and cost. The multiplexer...
In this paper, we present a comparison of high-voltage linear transmitter circuits for driving capacitive micro-machined ultrasound transducers (CMUTs). CMUTs are emerging transducer elements in ultrasound imaging applications. Two different circuit topologies for the high-voltage linear transmitter with a 40 V peak-to-peak output voltage are compared. We compare the two designs based on total harmonic...
This paper presents the high-level modeling and simulation of a GFSK RF transceiver for a Bluetooth Low Energy (BLE) system. This model, written in SystemC-AMS (SCAMS) permits a simple integration within the existing system digital environment written in SystemC-TLM, which enables a global system simulation to obtain the system performance (e.g. Bit-Error-Rate (BER) or Packet- Error-Rate (PER)) related...
A calibration free, high resolution second-order multichannel Incremental A-to-D-Converter with multi-level quantizer is presented. The system is designed for biomedical application and combines the advantages of low oversampling ratio with SC design solution, like multi bit topology and accurate opamp design. An optimal decimation filter to minimize the weighted sum of thermal and quantization noise...
A 12-bit counter ramp recycling analog-to-digital converter (ADC) is proposed, which can be configured in a single-step mode for achieving high conversion accuracy as well as in various multi-step modes for yielding high conversion speed. A unique ADC circuit realization is used for the different modes of operation, while a digital control unit is responsible for providing the necessary control signals...
A calibration circuit for single-ramp A-to-D converters is presented here. The calibration circuit allows to automatically compensate the process/mismatch and radiation effects on the A-to-D converter, improving performance and Equivalent Number of Bits. In particular, the calibration circuit is able to automatically align the ramp signal reference used for the conversion in single slope architectures...
A new type of low power decoding circuit for asynchronous sigma delta modulators is presented. The circuit implements a special coarse-fine time-to-digital converter to quantize the square wave produced by asynchronous sigma delta modulators, and converts the duty cycle to a digital output. The time-to-digital converter operates asynchronously by utilizing vernier delay lines. The purpose of this...
This paper presents a continuous-time ΣΔ ADC for MEMS microphone integrated interface applications. The ΣΔ modulator features a 3rd-order loop filter realized with only two operational amplifiers to reduce power consumption. It exploits a 15-level quantizer and 3-MHz sampling frequency to minimize the impact of clock jitter. The proposed architecture can handle an excess loop delay of half period...
A new sensing configuration based on the direct use of the metal input pad of a dedicated CMOS amplifier as a conductive substrate electrode for nanoscale high-performance electrical measurement with a standard conductive AFM is proposed and experimentally validated. Combining the state-of-the-art performance of an integrated current preamplifier (5MHz bandwidth, 14fA/sqrt(Hz) noise at 1MHz) with...
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