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An CMP process will be presented which is optimised for low layout sensitivity and good uniformity. The best results were obtained by using a stack of two polishing cloths, instead of a single cloth. This results in a better planarisation capability while improving the uniformity compared to a single hard polishing cloth. The feasibility of the novel CMP process was demonstrated on a 64k SRAM.
Performance requirements of displays, especially for portable applications push the limits in technology, circuit design and integration of electronics. Developments in Active Matrix Liquid Crystal Display (AMLCD) technology enable integration of semiconductor switching elements in individual pixels, the basic picture elements. With benefits from IC and related interconnect technology the manufacturing...
In this paper, the correlation between noise figure degradation and the degradation of DC characteristics during emitter-base reverse stress is studied. It was found that the generation-recombination centers, which introduce emitter-base reverse stress, have an influence on high-frequency noise characteristic degradation.
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