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Charge trapping and detrapping characteristics have been studied on thin Si3N4SiO2 stacked dielectric layers processed in an integrated vacuum system with separate modules for HF vapor etching, silicon thermal oxidation and Si3N4 low pressure chemical deposition. At low field, polarization effects are observed, together with residual conduction. A large current flows at higher fields (≫ 6MV.cm??1),...
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