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This paper introduces an ongoing research on geothermal cooling solution (GCS) for outdoor cabinets that are used to contain telecom equipment such as FTTX network, mobile network and etc. The principle of GCS is that the heat generated inside cabinet from telecom facilities is transferred to water by an air-water heat exchanger, and then water dissipates the heat to shallow underground soil by water-soil...
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute multiple applications (games, video), while meeting additional design constraints (energy consumption, time-to-market, etc.). Moreover, the rise of temperature in the die for MPSoCs, especially for forthcoming 3D chips,...
This paper presents measurements and simulations of a test integrated circuit. The circuit contains a matrix of heat sources and a set of temperature sensors, what renders possible measurement of circuit temperature in real cooling conditions inside a closed package. The measurements are validated for different patterns of power dissipation and cooling conditions with numerical simulations. Based...
Liquid cooling of electronic devices is widely accepted as the next logical step for electronics thermal management as board level air cooling becomes insufficient to meet the needs of next generation components and devices. One promising technology is liquid jet array impingement as it can achieve exceptionally high area averaged heat transfer coefficients. In this work the use of arrays of liquid...
A one dimensional dynamic system model for an electronics cooling loop with a microchannel heat sink is developed. This model is based on the conservation of mass, momentum and energy in the various components of the flow loop. Empirical correlations are used to calculate the pressure single-phase flow, but is constructed to facilitate a future transition to two-phase to two-phase flow. Special attention...
Experimental measurements in a spray cooling test rig have been carried out for different heat fluxes in the heater and different volumetric spray fluxes of the refrigerant. Results of the thermal parameters and the sprayed refrigerant liquid film thickness over the heater are presented. The film thickness measurements have been made with a high speed camera equipped with a long distance microscope...
We model a nanomaterial showing a hybrid thermal behavior between dissipative and insulating regimes. The nanomaterial is made up of a thin Si suspended membrane covered by self-assembled Ge quantum dots (QDs) with facets. A membrane plane is constituted from the orthogonal [100] and [001] directions (x and z, respectively). The QDs are stretched in [001] forming nanoscale phonon waveguides. When...
Carbon nanotube enhanced thermally conductive phase change material for heat dissipation has been studied in the present paper. It was indicated that the thermal resistance was greatly reduced by incorporating multi-walled carbon nanotubes into the organic matrix. The uniform distribution of carbon nanotubes has been realized by optimizing the dispersion parameters like temperature, shear strength,...
In this paper a possible method demonstrated for in-situ reliability testing of various TIM materials. The method is based on thermal transient measurements of a power semiconductor device in a TO-type package which has a flat, external cooling surface. By powering the junction of the semiconductor cyclically the whole assembly is exposed to intense thermal cycles in which the main heat-flow path...
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