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Nowadays, the demand for the printed wiring board (PWB) of the environment harmony type is rising rapidly. We have developed a new halogen-free material with low coefficients of thermal expansion (CTE), which will be applied to the plastic packages such as FC-BGA and CSP. The original resin system and filler treatment technique named FICS (filler interphase control system) were applied to the material...
High density interconnection structures using an area-arrayed small bump structure have been employed in multi chip packages and modules. Both the diameter and the pitch of the bump will be decreased from a few hundred mum to dozens mum. Copper thin film interconnection and lead-free solder (mainly consists of tin) is used for the micro joint structures. As a result, the intermetallic compounds (IMC)...
The transition to lead-free soldering of printed circuit boards (PCBs) using solder alloys such as Sn/Ag/Cu has resulted in higher temperature exposures during assembly compared with traditional eutectic Sn/Pb solders. Variations, if any, in laminate material properties before and after board assembly should be considered in the selection of appropriate laminates. This paper provides guidelines for...
The objective of the present study is to develop a robust high-throughput assembly process of light emitting diode arrays for wide area general lighting. Topics to be covered in this paper include the conceptual design, the flexible printed circuit substrate, flip chip assembly, yellow phosphor coating, and encapsulation. All these are integrated into one reel-to-reel assembly process. A prototype...
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